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Resonac Signs MOU with BEAM TECHNOLOGIES, Japan LEO Shachu and other partners for Semiconductor Manufacturing in Low Earth Orbit

Jun 29, 2026 | R&D

Resonac Achieves Approx. 40% Improvement in AI Image Analysis Accuracy

Dec 15, 2025 | R&D

Axiom Space and Resonac Sign MOU to Advance Space-Based Semiconductor Manufacturing

Oct 1, 2025 | R&D

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Semi Frontend Process

Semi Backend Process

Lithiumionbattery, Sliding

Innovation Materials

Chemical Materials

All Products

MCL-LW-990 (Type RFD)

MCL-HD60/HD80/HD90 (High Dk Multilayer Material)

Acrylonitrile

High-Purity Electronic-Grade Solvents

Anti-charging Material for Electron Beam Lithography

Cu and Barrier Metal Polishing Colloidal Silica Slurry

Ultra-low Defect Nano Ceria Slurry

High Removal Rate Ceria Slurry

High-Purity Solvent for Semiconductor Resists

High-Purity Electronic-Grade Solvents

High-Purity Sulfur Dioxide (SO2)

High-Purity Hydrogen Chloride (HCl)

High-Purity Silicon Tetrafluoride (SiF4)

High-Purity Hydrogen Fluoride (HF)

Functional monomer (Karenz)

Shodex

Alkylphenol resin (PR Series)

Adipic Acid based Polyester (TL Series)

High Heat Resistant Coating Materials (HIMAL)

PF-EL (Copper Foil for Fine Patterning)

TD-002 (Reduction of Solder Crack/Low Elastic Modulus Material)

MCL-I-671(Polyimide Multilayer Material)

MCL-E-700G (Type R) (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

MCL-HE-679G (Type S) (Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material)

GH-200 (Type D) (Thin Prepreg with Superior Surface Smoothness)

MCL-HS200 (Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material)

MCL-E-795G (Halogen Free, High Tg, High Elastic Modulus and Low CTE material)

MCL-E-770G (Type R) (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

MCL-E-705G (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

GEA-705G (Type F), GEA-770G (Type F) (Thin Prepreg with Superior Surface Smoothness)

MCL-E-679FG (Halogen Free, High Elastic Modulus, Low CTE Multilayer Material)

Chloroprene

ECOANN™

For TV/computer components fixture

For TV speaker nets bonding

For Plaque bonding

For Housing of TV, computer, smartphone

For TV, computer, smartphone (Polyolefin foam) housing

For Foam backing application (Low VOC type)

For Foam backing application

Vitamin E derivative (TPNa), water-soluble

Poly-N-vinylacetamide

Glycine

Vitamin C derivative (Ascorbyl PM), stable

Vitamin C derivative (Apprecier), high penetrative

Insulating Varnishes

High-performance imide-based heat-resistant resin (HPC Series)

Epoxy Resin Hardeners (HN-2200, MHAC-P)

Specialty Acrylate/Methacrylate monomer (Fancryl)

UV-Curable Resins (HA, TA Series)

Polysol

Continuous cast rod (SHOTIC ™)

Aluminum alloy forging

Extrusion and drawing bars of aluminum alloy

Thin fin heatsink

Abrasives

Cubic boron nitride (SBN K-TIP™)

Hexagonal Boron Nitride Powder (SHOBN™)

Alumina Beads / CB

Alumina (Roundish)

Reactive Hot Melt Adhesive for Construction material

Reactive Hot Melt Adhesive for Wooden panel lamination

Reactive Hot Melt Adhesive _Super-fine-pitch Coating for housing

Reactive Hot Melt Adhesive for Seat bonding

Solvent Type Adhesive for Folded-plate roofing

Solvent Type Adhesive for Resin panel bonding

Hot Melt Adhesive for Rear tray and seat back

Hot Melt Adhesive for Paper bag’s sealing

Reactive Hot Melt Adhesive for Bonding door housing assembly

Solvent Type Adhesive for Console decorative lamination

Hot Melt Adhesive for Ceiling ducts and soundproof materials

Hot Melt Adhesive for Carpeting floor bonding (PE/PP)

Hot Melt Adhesive for Automotive roof brackets

Reactive Hot Melt Adhesive for Bookbinding

Solvent Type Adhesive for Automotive upholstery fabric bonding

Thermal Conductive Sheet -Series of TC

Carbon Sliding Materials

Brush holder/Brush Rocker Units/Earthing Unit

Industrial Carbon Brush -Series of MH, GH

Anode Material for Lithium Ion Batteries

Map Molding Support Tape (RT Series)

Release film for package molding (RM-4000 Series)

Die Bonding Film (HS Series)

Dicing Die Bonding Film (FH Series)

Die Bonding Paste (EPINAL Series)

White Epoxy Molding Compounds for LED Reflector (CEL-W Series)

Liquid Encapsulants (underfill) for flip chip (CEL-C Series)

Epoxy Molding Compounds for organic substrate

Epoxy Molding Compounds for Lead Frame

SR7300 / SR-F Series

RY Series for PKG Board

RD Series for Direct Imaging

Adhesive Film for Display

Clean Gas Sulfer Hexafluoride

High-Purity Hydrogen Bromide (Hydrogen Bromide)

High-Purity FC-C318 (Octafluorocyclobutance)

SiC epitaxial wafer

AlGaAs epitaxial wafer

Clean Gas Chlorine

Clean Gas Boron Trichloride