We in Resonac will propose various solutions that are effective in solving problems in workshops and technical development.
High Thermal Conductive and Moisture Resistance AlN Filler
A bonding film allowing to construct a PTFE multilayer
Adhesive film with excellent adhesion to fluororesin. Low-temperature pressurization at 200°C enables multi-layering of fluororesin substrates.
Precision additive manufacturing using UV curable monomers
Fancryl 500 Series has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations.
What are transmission loss, dielectric loss, and dielectric loss tangent?
This article mainly explains the causes of transmission loss in printed circuit boards, calculation methods, and methods to reduce transmission loss.
A heat-resistant binder resin that conforms to REACH regulations
Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin.
Crosslinking agent for preventing degradation of rubber products
A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected.
WelQuick for multi-materials of automobile structural members
Example of using WelQuick. Simplify the process by bonding dissimilar materials in automotive structural components in a short amount of time. Also high adhesion is achieved.
Solder resists for flexible wiring boards “SN Series”
A modified polyimide resin that has both insulation and flexibility. Achieved excellent insulation reliability, detergent resistance, salt water resistance, and low leakage current.
Heat resistant coating binder PNVA GE191 Series
Realizes high heat resistant and thin ceramic coating layer for LIB separators, improving safety and energy density of LIBs.
Die-bonding paste providing 180 W/(m・k) of thermal conductivity.
It is a sintered copper bonding paste that has a thermal conductivity of 180 W/(m・K) and can be die-bonded with no pressure or low thermocompression pressure.
Stress-absorption prepreg for reducing solder cracks
It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress cracks.
High relative permittivity materials for transfer molding
It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent transmission performance even in high frequency bands.
Cleaning sheets for rubber molding that remove stains.
It can be cleaned simply by placing it in the mold and heating it. It not only shortens the cleaning time, but also contributes to improving productivity and maintaining quality.
WelQuick for base material connection in Roll to Roll process
Example of using WelQuick. Strong adhesion can be obtained simply by placing the film on the joints of the substrates in the Roll to Roll process such as FPC and heat-sealing them.
WelQuick: Quickly Bonding Film of Dissimilar Materials
Strong bonding of dissimilar materials can be achieved quickly by welded film, which applies to a diverse range of adhesion needs.
SKYVEHEATSINK realizing miniaturization and weight reduction
By reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation performan
High heat-resistant coating material that prevents delamination
It is a coating material that has both high heat resistance and adhesion. Prevents delamination between encapsulants and substrate materials even in harsh temperature environments.
Mold cleaning sheets for semiconductor manufacturing processes
A cleaning material made of thermosetting synthetic rubber. Place it on the mold, sandwich it between the molds and heat it to remove dirt.
A film capable of bonding a low heat-resistant circuit board
It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts.
Binder for lithium-ion batteries contributing to higher capacity
A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries.
WelQuick for leak sealing of terminal blocks
Example of using WelQuick. Leak sealing of large current terminals can be done easily. Easy to handle due to its film shape. WelQuick contribute to significant process reductions and cost reductions.
High reliability die bonding paste for total cost reduction
Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.
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