Case Study

PV-F leverages photolithography to form insulation layer patterns, enabling the creation of large cavities that are difficult to achieve with laser drilling, or numerous thermal vias without compromising throughput.

KT70X is a sintered compact PCBN suitable for interrupted cutting tools for stiff materials. With cBN content and dispersibility optimized compared with its conventional products, contributes to longer tool life with increased hardness and fracture resistance.

Resonac recommends its RF module substrate MCL-HS200 (Type D) that features both low dielectric properties and low CTE, and is suitable for multilayering.

Resonac proposes sintered copper paste (hereinafter, “sintered copper”) as a bonding material with superior heat resistance, heat dissipation, and reliability.

Resonac’s LW-990(RFD) achieves superiority in RF performance, wiring accuracy, processability, and reliability, thereby meeting the challenges of high accuracy, miniaturization, and high reliability required of 77 GHz-band millimeter-wave radar substrate materials.

Resonac’s Thermal Insulation Coating provides excellent heat-insulating, low thermal conductivity of 0.03 W/(m･K) and a maximum single-coat dry film thickness of 2 mm.

Resonac’s AR-5100 is a positive photosensitive material that achieves high resolution and applicable with aqueous developer.

Used as a sealing material primer,”HIMAL” increase adhesion between the lead frame,…

Fancryl 500 Series has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations.

This article mainly explains the causes of transmission loss in printed circuit boards, calculation methods, and methods to reduce transmission loss.

Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin.

A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected.

Realizes high heat resistant and thin ceramic coating layer for LIB separators, improving safety and energy density of LIBs.

It is a sintered copper bonding paste that has a thermal conductivity of 180 W/(m・K) and can be die-bonded with no pressure or low thermocompression pressure.

It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress cracks.

It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent transmission performance even in high frequency bands.

It can be cleaned simply by placing it in the mold and heating it. It not only shortens the cleaning time, but also contributes to improving productivity and maintaining quality.

By reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation performan

A cleaning material made of thermosetting synthetic rubber. Place it on the mold, sandwich it between the molds and heat it to remove dirt.

It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts.

A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries.

Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.