Home Products Products Find from Category Case Study Products Home Products R&D news Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules Mar 23, 2023 | R&D Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base Mar 13, 2023 | R&D RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development Mar 9, 2023 | R&D Find from Category Case Study Find from Category Search products Semi Frontend Process Semi Backend Process Lithiumionbattery, Sliding Innovation Materials Chemicals Case Study We in Resonac will propose various solutions that are effective in solving problems in workshops and technical development. Stress-absorption prepreg for reducing solder cracksIt is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress cracks. WelQuick for leak sealing of terminal blocksExample of using WelQuick. Leak sealing of large current terminals can be done easily. Easy to handle due to its film shape. WelQuick contribute to significant process reductions and cost reductions. Cleaning sheets for rubber molding that remove stainsIt can be cleaned simply by placing it in the mold and heating it. It not only shortens the cleaning time, but also contributes to improving productivity and maintaining quality. SKYVEHEATSINK realizing miniaturization and weight reductionBy reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation performance.
Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules Mar 23, 2023 | R&D
Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base Mar 13, 2023 | R&D
RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development Mar 9, 2023 | R&D