Europe

Resonac Europe

About Us
Corporate Profile
Company History
Promotion of Sustainable Procurement
Resonac CEO message
Resonac EU CEO Message
Corporate Philosophy
Long-term Vision
Code of Conduct
Close
Products
Semi Frontend Process
Innovation Materials
Semi Backend Process
Chemicals
Lithiumionbattery, Sliding
Case Study
General Terms and Conditions
Close
Careers
Job offers & Why Resonac
Your Entry
Close
News
Business
R&D
Sustainability
Others
Close
Home   >   News Release

News Releases

Show Filter

Filter by Category

Reset

2025.06.20

R&D

Resonac Conducts Evaluation of Semiconductor Materials for Space Applications Aboard International Space Station

2025.06.13

R&D

Joint Research and Development on Glycine Production Utilizing Emitted CO2 by Resonac, Nippon Steel, Nippon Steel Engineering, and the University of Toyama Selected by NEDO

2025.05.14

Sustainability

Resonac Holdings Selected as “SX Brand 2025”

2025.04.22

R&D

Resonac Corporation and Yokohama National University Sign a Comprehensive Partnership Agreement

2025.03.27

R&D

Resonac and Microwave Chemical Launch Full-Scale Development of Chemical Recycling Technology to Directly Convert Used Plastics into Basic Chemical Products

2025.03.14

Business

Regarding ISCC PLUS Certification at Resonac Europe GmbH

2025.03.05

R&D

Resonac Signs Patent License Agreement with Shimadzu Corporation

2025.02.12

Business

Resonac Develops Low Thermal Expansion Copper-Clad Laminates for Next-Generation Semiconductor Packages through Simulation

2025.01.27

R&D

Resonac’s Technology for Directly Recycling Mixed Plastic Wastes into Basic Chemicals Selected for NEDO’s Green Innovation Fund

2025.01.20

Business

Resonac Launces the Circular Business Model “CirculaC” for Used Plastics and Textiles

2024.12.02

Business

Resonac Develops New Photosensitive Film for Advanced Semiconductor Packages

2024.11.14

R&D

Resonac Develops AI-Powered Material Exploration Tool

2024.11.08

Business

Resonac’s Patent for Liquid Sealing Material for Semiconductors Upheld

2024.10.04

Sustainability

Ecosystem Conservation Activity Hub in Ibaraki Prefecture Recognized as a “Nature Coexistence Site” by the Ministry of the Environment

2024.09.24

Business

Resonac and Soitec Sign Agreement to Jointly Develop Bonded Substrates for SiC Power Semiconductors

2024.09.19

Business

Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages

2024.08.07

Sustainability

Resonac Commits to Biodiversity Conservation by Registering as a TNFD Adopter

2024.07.08

Business

Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley

2024.06.05

Business

Resonac join PCIM 2024

2024.05.28

Business

Resonac Corporation, Neste and Marubeni Corporation to cooperate on renewable chemicals in Japan