- Resonac Filed Patent Infringement Lawsuit on Photosensitive Films for Semiconductor Package Substrates and High-density Electronic Circuit Boards
- Resonac Develops an Original Generative AI, “Chat Resonac,” That Utilizes Accumulated In-house Materials Including Handwritten Documents
- Resonac Dramatically Reduces Materials Development Time Using AI Based on Deep Learning Technology
- Resonac Contracts with Nippon Yusen and JERA to Make Joint Effort to Realize Supply of Ammonia Fuel to a Tugboat
- Resonac Creates Chief Sustainability Officer (CSuO) as a New Position
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