Recent Posts
- Resonac Increases Capacity to Produce Materials for AI Chips
- Resonac Starts to Consider Recycling Plastic Waste Emitted from Semiconductor Manufacturing Process and Reusing It as Gases for Semiconductor Manufacturing
- JAXA Adopts Resonac’s Proposal to Study Heat Storage and Utilization System for Use on the Lunar Surface
- Participants in the ISES Japan Summit Visit Resonac’s Semiconductor Backend Process R&D Base
- Resonac Filed Patent Infringement Lawsuit on Photosensitive Films for Semiconductor Package Substrates and High-density Electronic Circuit Boards
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