GEA-705G (Type F), GEA-770G(Type F)
Thin Prepreg with Superior Surface Smoothness
Product
| Prepreg | GEA-705G (Type F) |
| GEA-770G (Type F) |
Applications
- Semiconductor packages. (FC-BGA, FC-CSP, PoP, SiP)
- HDI, PWB
- Thinner module, PWB
Features
- Superior in impedance control as prepreg thickness variation is small after press.
- Suitable for fine line formation with its smooth surface.
- Can achieve insulation layer thickness 16 µm.
- Suitable for coreless structure by superior variation of dimensional change.
- Undulation of TYPE-F prepreg is small after press and warpage can be reduced at assembly.
Characteristics
Surface Smoothness of Prepreg (Microscope)
TYPE-F
Conventional
Panel Warpage of Prepreg after press (w/o copper, by shadow moire)
TYPE- F
Conventional
Prepreg thickness after Press
Laminate condition
Sample
- GEA-705G 1010F78
- Copper foil: 3 µm
- Temp.: 230℃100min
- Heating rate: 3.0℃/min
- Pressure: 3MPa
Measurement method
Undulation of prepreg after press (GEA-705G1010F78)
TYPE-F
Conventional
Prepreg
| Item | Condition ※2 | Unit | Actual Value | Test Method | |||
|---|---|---|---|---|---|---|---|
| GEA-705G | GEA-770G | (IPC-TM-650) | |||||
| Tg | TMA method | A | ℃ | 250–270 | 260–280 | 2.4.24.5 | |
| DMA method | A | 295–305 | 300–330 | – | |||
| CTE ※1 (Pull) | X (30–120℃) | A | ppm/℃ | 8–10 | 6–7 | 2.4.24.5 | |
| Y (30–120℃) | 2–5 | 2–4 | |||||
| T-260 (Without Copper) | A | min. | ＞60 | ＞60 | 2.4.24.1 | ||
| T-288 (Without Copper) | ＞60 | ＞60 | |||||
| Undulation (After Press) | A | mm | 0.0–0.3 | 0.0–0.3 | – | ||
※1 Heating Rate: 10℃/min.
※2 Refer to“Condition Note”
※ Above data are experimental results and not guaranteed.
Standard Specifications
Prepreg
| Part Number | Type | Glass Cloth | Properties | |||
|---|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 (mm) |
||||
| GEA-705G | – | 0.020 | 1010F74 | 1010 | 74±2 | 0.021 |
| 1010F76 | 76±2 | 0.023 | ||||
| 1010F78 | 78±2 | 0.025 | ||||
| 1010F80 | 80±2 | 0.027 | ||||
| 1010F84 | 84±2 | 0.035 | ||||
| 0.025 | 1017F73 | 1017 | 73±2 | 0.025 | ||
| 1017F78 | 78±2 | 0.031 | ||||
| 1017F83 | 83±2 | 0.040 | ||||
| GEA-770G | – | 0.020 | 1010F67 | 1010 | 67±2 | 0.016 |
| 1010F69 | 69±2 | 0.018 | ||||
| 1010F71 | 71±2 | 0.019 | ||||
| 1010F73 | 73±2 | 0.021 | ||||
| 1010F78 | 78±2 | 0.026 | ||||
| 1010F82 | 82±2 | 0.032 | ||||
| 0.025 | 1017F73 | 1017 | 73±2 | 0.026 | ||
| 1017F78 | 78±2 | 0.033 | ||||
| 1017F83 | 83±2 | 0.043 | ||||
| 0.030 | 1027F73 | 1027 | 73±2 | 0.042 | ||
| 1027F78 | 78±2 | 0.052 | ||||
| Reference (IPC-TM-650) | 2.3.16 | – | ||||
※1 The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. This value changes depending on the press condition or inner layer pattern.
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