HPC series
High-performance imide-based heat-resistant resin
About the product
Poly Amide Imide (PAI) is a resin component having imide combination and amide bond in molecule.PAI has high heat resistance (Tg＞270℃、heat decomposition starting temperature＞400℃) and coating hardness. It also can form the film having high isolation and solvent resistant.
HPC series is PAI solution with high function from Resonac.
Product lineup
| Grade | Solid content (%) | Viscosity (Pa・s) | Solvent | Feature |
|---|---|---|---|---|
| HPC-5012 | 30~34 | 3~6 | NMP = 100 | Basic grade |
| HPC-1000 | 28 | 3 | NMP/ion water = 52/48 | Water borne product |
| HPC-6600 | 30~33 | 3~6 | New Solvent | NMP Free product |
| HPC-2200 | 27~30 | 2~4 | New Solvent /water |
Water borne product |
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