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Semi Backend Process

Semi Frontend Process

Semi Backend Process

Lithiumionbattery, Sliding

Innovation Materials

Chemicals Materials

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High Heat Resistant Coating Materials (HIMAL)

Standards

PF-EL (Copper Foil for Fine Patterning)

TD-002 (Reduction of Solder Crack/Low Elastic Modulus Material)

MCL-I-671(Polyimide Multilayer Material)

MCL-E-700G (Type R) (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

MCL-HE-679G (Type S) (Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material)

GH-200 (Type D) (Thin Prepreg with Superior Surface Smoothness)

MCL-HS200 (Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material)

MCL-E-795G (Halogen Free, High Tg, High Elastic Modulus and Low CTE material)

MCL-E-770G (Type R) (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

MCL-E-705G (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

GEA-705G (Type F), GEA-770G (Type F) (Thin Prepreg with Superior Surface Smoothness)

MCL-E-679FG (Halogen Free, High Elastic Modulus, Low CTE Multilayer Material)

Map Molding Support Tape (RT Series)

Release film for package molding (RM-4000 Series)

Cleaning Sheet for molding process (N-CS series)

Die Bonding Film (HS Series)

Dicing Die Bonding Film (FH Series)

Die Bonding Paste (EPINAL Series)

White Epoxy Molding Compounds for LED Reflector (CEL-W Series)

Liquid Encapsulants (underfill) for flip chip (CEL-C Series)

Epoxy Molding Compounds for organic substrate

Epoxy Molding Compounds for Lead Frame

SR7300 / SR-F Series

RY Series for PKG Board

RD Series for Direct Imaging

HM Series for Thick Resist Layer

Adhesive Film for Display

Anisotropic Conductive Films for FPC & COF

Anisotropic Conductive Films for Solderless Connective Film (MF Series)

Anisotropic Conductive Films for for IC chip