Europe

Resonac Europe

About Us
Corporate Profile
Company History
Promotion of Sustainable Procurement
Resonac CEO message
Resonac EU CEO Message
Corporate Philosophy
Long-term Vision
Code of Conduct
Close
Products
Semi Frontend Process
Innovation Materials
Semi Backend Process
Chemicals
Lithiumionbattery, Sliding
Case Study
General Terms and Conditions
Close
Careers
Job offers & Why Resonac
Your Entry
Close
News
Business
R&D
Sustainability
Others
Close
  1. Home
  2. Products
  3. Semi Backend Process
Semi Backend Process

Semi Frontend Process

Semi Backend Process

Lithiumionbattery, Sliding

Innovation Materials

Chemicals Materials

See All Products

Choose product category

High Heat Resistant Coating Materials (HIMAL)

Standards

PF-EL (Copper Foil for Fine Patterning)

TD-002 (Reduction of Solder Crack/Low Elastic Modulus Material)

MCL-LW-900G/910G (Halogen Free, High Tg, Low Transmission Loss Multilayer Material)

MCL-I-671(Polyimide Multilayer Material)

MCL-E-78G (Halogen Free, Low Dielectric Constant, High Tg, High Heat Resistance Multilayer Material)

MCL-E-700G (Type R) (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

MCL-HE-679G (Type S) (Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material)

GH-100 (Type D), GH-200 (Type D) (Thin Prepreg with Superior Surface Smoothness)

MCL-HS100 (Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material)

MCL-HS200 (Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material)

MCL-E-795G (Halogen Free, High Tg, High Elastic Modulus and Low CTE material)

MCL-E-770G (Type R) (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

MCL-E-705G (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

GEA-705G (Type F), GEA-770G (Type F) (Thin Prepreg with Superior Surface Smoothness)

MCL-E-679FG (Halogen Free, High Elastic Modulus, Low CTE Multilayer Material)

Map Molding Support Tape (RT Series)

Release film for package molding (RM-4000 Series)

Cleaning Sheet for molding process (N-CS series)

Die Bonding Film (HS Series)

Dicing Die Bonding Film (FH Series)

Die Bonding Paste (EPINAL Series)

White Epoxy Molding Compounds for LED Reflector (CEL-W Series)

Liquid Encapsulants (underfill) for flip chip (CEL-C Series)

Epoxy Molding Compounds for organic substrate

Epoxy Molding Compounds for Lead Frame

Photosensitive Insulation Coating materisl for RDL (AH series)

SR7300 / SR-F Series

RY Series for PKG Board

RD Series for Direct Imaging

HM Series for Thick Resist Layer

Adhesive Film for Display

Anisotropic Conductive Films for FPC & COF

Anisotropic Conductive Films for Solderless Connective Film (MF Series)

Anisotropic Conductive Films for for IC chip