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Semi Backend Process

Semi Frontend Process

Semi Backend Process

Lithiumionbattery, Sliding

Innovation Materials

Chemicals Materials

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Base Materials for PWBs

Standards

PF-EL (Copper Foil for Fine Patterning)

TD-002 (Reduction of Solder Crack/Low Elastic Modulus Material)

MCL-LW-900G/910G (Halogen Free, High Tg, Low Transmission Loss Multilayer Material)

MCL-I-671(Polyimide Multilayer Material)

MCL-E-78G (Halogen Free, Low Dielectric Constant, High Tg, High Heat Resistance Multilayer Material)

MCL-E-700G (Type R) (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

MCL-HE-679G (Type S) (Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material)

GH-100 (Type D), GH-200 (Type D) (Thin Prepreg with Superior Surface Smoothness)

MCL-HS100 (Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material)

MCL-HS200 (Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material)

MCL-E-795G (Halogen Free, High Tg, High Elastic Modulus and Low CTE material)

MCL-E-770G (Type R) (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

MCL-E-705G (Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material)

GEA-705G (Type F), GEA-770G (Type F) (Thin Prepreg with Superior Surface Smoothness)

MCL-E-679FG (Halogen Free, High Elastic Modulus, Low CTE Multilayer Material)

Coating Materials

High Heat Resistant Coating Materials (HIMAL)

Photosensitive Insulation Coating materisl for RDL (AH series)

Display Related Materials

Anisotropic Conductive Films for FPC & COF

Anisotropic Conductive Films for Solderless Connective Film (MF Series)

Anisotropic Conductive Films for for IC chip

Die Bonding Materials

Die Bonding Film (HS Series)

Dicing Die Bonding Film (FH Series)

Die Bonding Paste (EPINAL Series)

Functional Films

Adhesive Film for Display

Molding Materials

Map Molding Support Tape (RT Series)

Release film for package molding (RM-4000 Series)

Cleaning Sheet for molding process (N-CS series)

White Epoxy Molding Compounds for LED Reflector (CEL-W Series)

Liquid Encapsulants (underfill) for flip chip (CEL-C Series)

Epoxy Molding Compounds for organic substrate

Epoxy Molding Compounds for Lead Frame

Photosensitive Materials for PWBs

SR7300 / SR-F Series

RY Series for PKG Board

RD Series for Direct Imaging

HM Series for Thick Resist Layer