Resonac Europe

MCL-E-795G

Halogen Free, High Tg, High Elastic Modulus and Low CTE material

Product form

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CCL MCL-E-795G
Prepreg GEA-795G

Applications

  • Semiconductor pakages. (FC-BGA)
  • Center core for Buildup construction.

Features

  • MCL-E-795G has low CTE value in X, Y directions and can reduce warpage of package significantly.
  • MCL-E-795G type LH has low CTE value.
  • Well-suited for Center Core of Buildup construction.

Characteristics

Warpage Performance [3-2-3 construction]

TEG Chip

  • Die size: 20mm×20mm
  • Die height: 775 µm
TEG Substrate

  • Package size: 40mm×40mm
  • Core thickness: 0.4mm / 0.8mm
  • BU thickness: 20 µm
  • SR thickness: 19 µm

Copper Clad Laminate

(t0.4mm)

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Item Condition ※4 Unit Actual Value Reference
(IPC-TM-650)
MCL-E-
795G
MCL-E-
795G
(Type X)
MCL-E-
795G
(Type L)
MCL-E-
795G
(Type LH)
Tg TMA method A 260–290 2.4.24
DMA method A 315–345
CTE ※1 X (30–120℃) A ppm/℃ 3.0–5.0 2.0–4.0 1.0–3.5 0.5–3.0
Y (30–120℃) A 3.0–5.0 2.0–4.0 1.0–3.5 0.5–3.0
※2 (<Tg) A 10–15 2.4.24
(>Tg) A 70–100
Solder Heat Resistance (260℃) A sec. >300
T-260 (Without Copper) A min. >60 2.4.24.1
T-288 (Without Copper) A >60
Decomposition Temperature (TGA, 5% weight loss) A 470–490 2.3.40
Heat Resistance for HDI Process (Semi-Additive) 260℃ Reflow cycles >20
Copper Peel Strength 12 µm A kN/m 0.7–0.9 2.4.8
18 µm A 0.8–1.0
Flexural Modulus (X) ※2 A GPa 35–37 37–39 39–41 40–42
Dielectric Constant 1GHz ※3 A 4.3–4.5 4.2–4.4 4.1–4.3 4.1–4.3
Dissipation Factor 1GHz ※3 A 0.005–0.007 0.005–0.007 0.005–0.007 0.005–0.007
Volume Resistivity C-96/40/90 Ω・cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016
D-2/100 1×1012–1×1015

※1  Heating Rate: 10℃/min.
※2  For 800um thickness.
※3  Measured by SPDR.
※4  Refer to “Condition Note”
※  Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

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Part Number Type Copper Foil Thickness Thickness Code Actual thickness and Tolerance
MCL-E-
795G
12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP)
M0.06 0.06mm
0.1 0.11mm
0.2 0.21mm
0.41 0.41mm
0.61 0.61mm
0.81 0.82mm
1.01 1.02mm
1.21 1.23mm
1.41 1.43mm
(X) 12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP)
0.41 0.41mm
0.61 0.62mm
0.81 0.82mm
1.01 1.02mm
1.21 1.23mm
1.41 1.43mm
(L) 12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP)
0.1 0.11mm
0.2 0.21mm
0.41 0.41mm
0.61 0.62mm
0.81 0.82mm
1.01 1.03mm
1.21 1.24mm
1.41 1.44mm
(LH) 12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP)
D0.15 0.16mm
0.2 0.21mm
0.41 0.43mm
0.61 0.64mm
0.81 0.85mm
1.01 1.07mm
1.21 1.28mm
1.41 1.49mm

※1  STD: Standard copper foil, LP: Low Profile copper foil.
※2  The thickness means that of dielectric layer.

Prepreg

スクロール

Part Number Type Glass Cloth Properties
Style Resin Content
(%)
Dielectric Thickness
after Lamination ※1 (mm)
GEA-795G 0.03 (1027N76) 1027 76±2 0.044
0.04 (1037N76) 1037 76±2 0.053
0.06 (1078N66) 1078 66±2 0.072
(L) 0.03 (1027N76) 1027 76±2 0.044
0.04 (1037N76) 1037 76±2 0.053
0.06 (1280N63) 1280 63±2 0.072

※1  The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 0%.

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