Die Bonding Film HS Series
About the product
HS Series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. The uniform die bonding layer can be obtained by a simple laminating process.
Features
- Excellent stress reduction by low elastic modulus.
- Excellent gap filling capability of substrate.
- Applicable for thicker film.
Characteristics (Typical Values)
| Item | Unit | HS-260 | HS-270 | Test method | |
|---|---|---|---|---|---|
| Thickness | μm | 20, 25 | 10, 20, 25 | – | |
| Die bonding condition | Temp. | ºC | 120~160 | 120~160 | – |
| Load | MPa | 0.04 | 0.04 | – | |
| Tensile modulus (25ºC) | MPa | 5,000 | 1,000 | DMA | |
| Tg | ºC | 153 | 180 | TMA | |
| Die shear strength (260ºC) | N/chip | >100 | >100 | 5x5mm chip | |
Inquirer about product
Please subscribe our technology eNewsletter!
Inquiry about product
Please inquire about product, technology or samples from here.