Resonac Europe

MCL-I-671

Polyimide Multilayer Material

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CCL MCL-I-671
Prepreg GIA-671N

Applications

  • Main frame computers and super computers.
  • Semiconductor testing equipment, and burn-in boards.
  • Flex-rigid PWBs. (No-flow prepreg)

Features

  • High Tg (>200℃: DMA) material for high throughhole reliability.
  • FR-4 lamination condition can be applied. (175℃, 90 min.)
  • MDA, a general polyimide resin curing agent, is not used. (Non-MDA Resin System)
  • Resin flow control technology enables from high to low flow.

Characteristics

  • Correlation between Dielectric Constant and Frequency

(t0.8mm)

※  Measured by Triplate-line Resonator.

  • Correlation between Dissipation Factor and Frequency

(t0.8mm)

  • Barcol Hardness

(t0.8mm)

  • Water Absorption

PCT Condition: 121℃ 0.22MPa    (t0.8mm)

  • Thermal Shock Test MIL-STD-202

Method 107E

  • Flexural Strength

Copper Clad Laminate

(t0.8mm)

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Item Condition ※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-I-671
Tg TMA method A 200–213 2.4.24
DMA method A 230–245
CTE ※1 X (30–120℃) A ppm/℃ 12–15
Y (30–120℃) 12–16
Z <Tg A 50–80 2.4.24
>Tg A 200–300
Solder Heat Resistance (260℃) A sec. >300
T-260 (Without Copper) A min. >60 2.4.24.1
T-288 (Without Copper) A >15
Decomposition Temperature (TGA method 5% Weight Loss) A 330–350 2.3.40
Copper Peel Strength 20℃ A kN/m 1.3–1.5 2.4.8
(18 µm) 180℃ A 1.0–1.2
Flexural Modulus (Lengthwise) A GPa 24–26 2.4.4
Dielectric Constant 1MHz A 4.2–4.4 2.5.5.9
1GHz ※2 A 4.1–4.3 JPCA TM-001
Dissipation Factor 1MHz A 0.0110–0.0130 2.5.5.9
1GHz ※2 A 0.0130–0.0150 JPCA TM-001
Volume Resistivity C-96/40/90 Ω・cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016
D-2/100 1×1012–1×1014

※1  Heating Rate: 10℃/min.
※2  Measured by Triplate-line Resonator.
※3  Refer to“Condition Note”
※    Above data are experimental results and not guaranteed.

Standard Specifications

Prepreg

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Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-I-671 0.06 0.06mm
12 µm 0.1 0.10mm
18 µm 0.2 0.20mm
35 µm 0.3 0.30mm
70 µm 0.41 0.41mm
0.79 0.79mm

※  The thickness means that of dielectric layer.

Prepreg

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Part Number Type Glass Cloth Properties Part Number
Style Resin Content
(%)
Dielectric Thickness
after Lamination ※1 (mm)
GIA-671N (T) 0.03 106 72±3 0.059 MLB
0.05 1080 65±3 0.087
0.1 2116 54±3 0.134
(N) 0.03 106 68±3 0.047 Flex-rigid PWBs
0.05 1080 59±3 0.072
(F) 0.05 1080 74±3 0.111 Metal core PWBs
Reference (IPC-TM-650) 2.3.16

※1  Dielectric thickness after lamination is defined as the theoretical calculation thickness of one sheet of prepreg when the resin flow is 0%. Value changes depending on the press condition or inner layer pattern.

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