Products

R&D news

Resonac Participates Semiconductor Assembly Test Automation and Standardization Research Association (SATAS)

May 7, 2024 | R&D

Mar 21, 2024 | R&D

Mar 7, 2024 | R&D

Search products

Semi Frontend Process

Semi Backend Process

Lithiumionbattery, Sliding

Innovation Materials

Chemicals

We in Resonac will propose various solutions that are effective in solving problems in workshops and technical development.

Stress-absorption prepreg for reducing solder cracks
It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress cracks.
WelQuick for leak sealing of terminal blocks
Example of using WelQuick. Leak sealing of large current terminals can be done easily. Easy to handle due to its film shape. WelQuick contribute to significant process reductions and cost reductions.
Cleaning sheets for rubber molding that remove stains
It can be cleaned simply by placing it in the mold and heating it. It not only shortens the cleaning time, but also contributes to improving productivity and maintaining quality.
SKYVEHEATSINK realizing miniaturization and weight reduction
By reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation performance.