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We in Resonac will propose various solutions that are effective in solving problems in workshops and technical development.

Stress-absorption prepreg for reducing solder cracks
It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress cracks.
Improve flexibility of heat dissipation design for power devices’ embedded substrates

PV-F leverages photolithography to form insulation layer patterns, enabling the creation of large cavities that are difficult to achieve with laser drilling, or numerous thermal vias without compromising throughput.
Cleaning sheets for rubber molding that remove stains

It can be cleaned simply by placing it in the mold and heating it. It not only shortens the cleaning time, but also contributes to improving productivity and maintaining quality.
SKYVEHEATSINK realizing miniaturization and weight reduction

By reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation performance.