by weissblaumedia | Dec 6, 2022
Home Project TD-002 Reduction of Solder Crack/Low Elastic Modulus Material ; Product form ; Applications ; Features ; Characteristics ; Standard Specifications Product form Prepreg TD-002 Applications Electronic equipment for automobiles. Engine room set board. PCB on...
by weissblaumedia | Dec 5, 2022
Home Project Page 2 MCL-I-671 Polyimide Multilayer Material ; Product form ; Applications ; Features ; Characteristics ; Standard Specifications Product form CCL MCL-I-671 Prepreg GIA-671N Applications Main frame computers and super computers. Semiconductor testing...
by weissblaumedia | Dec 5, 2022
Home Project Page 3 MCL-E-700G (Type R) Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material ; Product form ; Applications ; Features ; Characteristics ; Standard Specifications Product form CCL MCL-E-700G (Type R) Prepreg GEA-700G Applications...
by weissblaumedia | Dec 2, 2022
Home Project Page 3 MCL-HE-679G (Type S) Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material ; Product form ; Applications ; Features ; Characteristics ; Standard Specifications Product form CCL MCL-HE-679G (Type S) Prepreg GHA-679G (Type...
by weissblaumedia | Dec 2, 2022
Home Project Page 6 GH-200 (Type D) Thin Prepreg with Superior Surface Smoothness ; Product form ; Applications ; Features ; Characteristics ; Standard Specifications Product form Prepreg GH-200 (Type D) Applications Semiconductor packages. (FC-CSP, PoP, SiP) Thinner...
