Resonac Europe

Epoxy Molding Compounds for organic substrate

Home Project Page 20 Epoxy Molding Compounds for organic substrate ; About the product ; Features ; Characteristics (Typical Values) About the product This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also...

Epoxy Molding Compounds for Lead Frame

Home Page 33 Search results for: Epoxy Molding Compounds for Lead Frame ; About the product ; Features ; Characteristics (Typical Values) About the product We have a top-level market share in epoxy molding compounds. Our products meet the customers’ demands and...

SR7300 / SR-F Series

Home Photosensitive Materials for PWBs SR7300 / SR-F Series Photosensitive Solder Resist ; About the product ; Features ; Properties ; Thermal cycle test About the product Photosensitive solder resist, SR7300/SR-F, are optimized for package substrate. Features Low...