by weissblaumedia | Nov 24, 2022
Home Project Page 19 Dicing Die Bonding Film FH Series Die Bonding Film ; About the product ; Features ; Characteristics (Typical Values) About the product FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes...
by weissblaumedia | Nov 24, 2022
Home Project Page 20 Die Bonding Paste (EPINAL Series) ; About the product ; Features ; Characteristics (Typical Values) About the product Resonac’s solvent-free die bonding paste (conductive and non-conductive types) bonds chips to leadframes and organic substrates...
by weissblaumedia | Nov 24, 2022
Home Project Page 20 White Epoxy Molding Compounds for LED Reflector (CEL-W Series) ; About the product ; Features ; Characteristics (Typical Values) About the product CEL-W series is thermoset resin for reflector of surface mount LED. LED reflector with good...
by weissblaumedia | Nov 24, 2022
Home Project Page 20 Liquid Encapsulants (underfill) for flip chip (CEL-C Series) ; About the product ; Features ; Characteristics (Typical Values) About the product We develop various types of liquid encapsulants along with cutting-edge packaging trend, COF, FCBGA,...
by weissblaumedia | Nov 24, 2022
Home Project Page 20 Epoxy Molding Compounds for organic substrate ; About the product ; Features ; Characteristics (Typical Values) About the product This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also...
