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2024.11.14

Resonac Develops AI-Powered Material Exploration Tool

2024.05.07

Resonac Participates Semiconductor Assembly Test Automation and Standardization Research Association (SATAS)

2024.03.21

JAXA Adopts Resonac’s Proposal to Study Heat Storage and Utilization System for Use on the Lunar Surface

2024.03.07

Participants in the ISES Japan Summit Visit Resonac’s Semiconductor Backend Process R&D Base

2024.01.18

Resonac Develops an Original Generative AI, “Chat Resonac,” That Utilizes Accumulated In-house Materials Including Handwritten Documents

2023.12.21

Resonac Dramatically Reduces Materials Development Time Using AI Based on Deep Learning Technology

2023.11.22

Resonac Participates in a US-based Leading-edge Semiconductor Consortium as The First Japanese Strategic Material Manufacturing Partner

2023.11.22

Resonac Plans to Establish Semiconductor Back End Process R&D Center in Silicon Valley

2023.09.22

Resonac Forms Strategic Partnership with Matmerize in Materials Informatics

2023.03.23

Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules

2023.03.13

Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base

2023.03.09

RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development

2023.01.12

Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors