by Kyogo Komiyama | Mar 21, 2024 | R&D
21 March 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) proposed Japan Aerospace Exploration Agency (hereinafter “JAXA”) to conduct research into heat storage and utilization system for use on the lunar surface, which is expected to...
by Kyogo Komiyama | Mar 7, 2024 | R&D
07 March 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) conducted a tour of its Packaging Solution Center (Kawasaki City, Kanagawa Prefecture, hereinafter referred to as “PSC”), an R&D facility of backend...
by Kyogo Komiyama | Jan 18, 2024 | R&D
18 January 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) has developed an in-house generative AI system named “Chat Resonac” which can interactively utilize accumulated data and documents of former Showa Denko K.K. and former Hitachi...
by Kyogo Komiyama | Dec 21, 2023 | R&D
21 December 2023 Resonac Corporation (President: Hidehito Takahashi) has developed in-house a cheminformatics(*1) application program that utilizes artificial intelligence (AI) based on deep learning technology. It has begun using the application to maximize its vast...
by Kyogo Komiyama | Nov 22, 2023 | R&D
22 November 2023 Resonac Corporation (President: Hidehito Takahashi) will take part in a consortium of semiconductor-related manufacturers named “Texas Institute for Electronics” (hereinafter “TIE”), which is located in the state of Texas, USA. Resonac will be the...
by Kyogo Komiyama | Nov 22, 2023 | R&D
22 November 2023 Today, Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) announces that it plans to establish a research and development center for semiconductor packaging technologies and semiconductor materials in Silicon Valley,...
