by Kyogo Komiyama | Mar 7, 2024 | R&D
07 March 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) conducted a tour of its Packaging Solution Center (Kawasaki City, Kanagawa Prefecture, hereinafter referred to as “PSC”), an R&D facility of backend...
by Kyogo Komiyama | Jan 18, 2024 | R&D
18 January 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) has developed an in-house generative AI system named “Chat Resonac” which can interactively utilize accumulated data and documents of former Showa Denko K.K. and former Hitachi...
by Kyogo Komiyama | Dec 21, 2023 | R&D
21 December 2023 Resonac Corporation (President: Hidehito Takahashi) has developed in-house a cheminformatics(*1) application program that utilizes artificial intelligence (AI) based on deep learning technology. It has begun using the application to maximize its vast...
by Kyogo Komiyama | Nov 22, 2023 | R&D
22 November 2023 Resonac Corporation (President: Hidehito Takahashi) will take part in a consortium of semiconductor-related manufacturers named “Texas Institute for Electronics” (hereinafter “TIE”), which is located in the state of Texas, USA. Resonac will be the...
by Kyogo Komiyama | Nov 22, 2023 | R&D
22 November 2023 Today, Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) announces that it plans to establish a research and development center for semiconductor packaging technologies and semiconductor materials in Silicon Valley,...
by Kyogo Komiyama | Sep 22, 2023 | R&D
22 September, 2023 Aiming to develop new semiconductor materials that revolutionize the landscape of 6G technology, Resonac Corporation (President: Hidehito Takahashi) has formed strategic partnership with Matmerize Inc., which is a US startup company recently spun...
