by Kyogo Komiyama | Mar 9, 2023 | R&D
09 March 2023 Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) has successfully applied virtual reality (VR) technology*1 to the development of semiconductor materials. This is the first time that the VR technology has been implemented to develop...
by Kyogo Komiyama | Mar 1, 2023 | Business
01 March 2023 Resonac Corporation (Tokyo: 4004, President: Hidehito Takahashi) has developed a third generation of high-grade silicon carbide (SiC) epitaxial wafer (HGE-3G) for power semiconductors and has started to mass-produce it. HGE-3G has quality superior to...
by Kyogo Komiyama | Jan 12, 2023 | R&D
12 January 2023 Resonac Corporation (Resonac) (President: Hidehito Takahashi) has concluded new multiyear contracts with Infineon Technologies AG (Infineon), a German semiconductor manufacturer providing power semiconductors worldwide, to continue supplying SiC...
by Kyogo Komiyama | Jan 4, 2023 | Business
04 January 2023 -CEO Takahashi Gives New Year Address following the Launch of Resonac- On January 1, 2023, Showa Denko K.K. (SDK) and Showa Denko Materials Co., Ltd. (SDMC, former Hitachi Chemical Company, Ltd.) merged and transformed themselves into two new...
