by Kyogo Komiyama | Apr 4, 2023 | Others
04 April 2023 On July 1, 2023, Resonac Holdings Corporation (Tokyo: 4004) and Resonac Corporation (President of both companies: Hidehito Takahashi) will integrate and relocate their head offices, which are now located at two different places, aiming to speed up their...
by Kyogo Komiyama | Apr 4, 2023 | Business
04 April 2023 Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) will increase its capacity to produce “Dicing Die Bonding Film,” which is a two-in-one adhesive film with the functions for both dicing tape and die bonding film used in semiconductor...
by Kyogo Komiyama | Mar 31, 2023 | Business
31 March 2023 DENSO CORPORATION has decided to adopt silicon carbide epitaxial wafer for power semiconductor (SiC epi-wafer) manufactured by Resonac Corporation (Tokyo: 4004) (President: Hidehito Takahashi) with the aim of using it as material for driver element of...
by Kyogo Komiyama | Mar 23, 2023 | R&D
23 March 2023 Resonac Corporation (TOKYO: 4004) (President: Hidehito Takahashi) is set to launch full-scale operation of Power Module Integration Center (“PMiC”), which is located at Oyama Plant in Tochigi Prefecture, to enhance development activity of materials for...
by Kyogo Komiyama | Mar 13, 2023 | R&D
13 March 2023 In January 2023, Resonac Corporation (TOKYO: 4004) (President and CEO: Hidehito Takahashi) is launching a project to develop new semiconductor materials for 6G, the next-generation telecommunication system standard following 5G. Resonac will implement...
