by Kyogo Komiyama | Nov 22, 2023 | R&D
22 November 2023 Today, Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) announces that it plans to establish a research and development center for semiconductor packaging technologies and semiconductor materials in Silicon Valley,...
by Kyogo Komiyama | Oct 2, 2023 | Business
02 October, 2023 Resonac hold free webinar session “Material Solutions for Next Generation Power Module”on 26 th October 2023, twice in same day for EU, US and Asia. Please join us for an enlightening session covering advanced materials in Power Module...
by Kyogo Komiyama | Sep 22, 2023 | R&D
22 September, 2023 Aiming to develop new semiconductor materials that revolutionize the landscape of 6G technology, Resonac Corporation (President: Hidehito Takahashi) has formed strategic partnership with Matmerize Inc., which is a US startup company recently spun...
by Kyogo Komiyama | Sep 4, 2023 | Business
04 September, 2023 We kindly invite all interested persons to visit us at ICSCRM 2023, the international conference on silicon carbide and related materials. Colleagues from all over Resonac group will be attending. We look forward to seeing you there. We exhibit SiC...
by Kyogo Komiyama | Aug 3, 2023 | Business
03 August, 2023 Resonac Corporation (President: Hidehito Takahashi) announces that its Oita Complex (Oita City, Oita Prefecture) has acquired ISCC PLUS certification, one of the international certification systems for sustainable products. This acquisition of ISCC...
