by Kyogo Komiyama | Oct 4, 2024 | Sustainability
October 04, 2024 Resonac Holdings Corporation (President: Hidehito Takahashi, hereinafter referred to as “REH”) is pleased to announce that “Sakuragawa Kyoso-no-Sato” (“Sakuragawa Co-creation Village”: Sakuragawa City, Ibaraki Prefecture), the...
by Kyogo Komiyama | Sep 24, 2024 | Business
September 24, 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter referred to as “Resonac”) has signed an agreement with Soitec (CEO: Pierre Barnabé, hereinafter referred to as “Soitec”), a French manufacturer of advanced...
by Kyogo Komiyama | Sep 19, 2024 | Business
September 19, 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process)...
by Kyogo Komiyama | Aug 7, 2024 | Sustainability
07 August 2024 Resonac Holdings Corporation (President: Hidehito Takahashi, hereinafter referred to as “Resonac”) has expressed its support for the disclosure recommendations published in September 2023 by the Taskforce on Nature-related Financial...
by Kyogo Komiyama | Jul 8, 2024 | Business
08 July 2024 UNION CITY, Calif. – July 8, 2024 – Resonac Corporation today unveiled a new consortium of ten partners, called “US-JOINT,” for its semiconductor back-end process R&D in Silicon Valley. The ten American and Japanese semiconductor materials and...
