by Kyogo Komiyama | Jul 8, 2025 | R&D
July 08 2025 [Key Points of the News Release] ●Resonac and Tohoku University have commenced full-scale examination to apply the technology for producing SiC from silicon sludge and CO2 to the crystal growth of materials for SiC power semiconductors.●This technology...
by Kyogo Komiyama | Jun 27, 2025 | Business
June 27 2025 Tokyo, Japan and Austin, TX, Resonac Corporation and PulseForge, Inc. announced a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, 2025. This collaboration aims to drive...
by Kyogo Komiyama | Jun 20, 2025 | R&D
June 19 2025 Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) is set to begin evaluation experiments aboard the International Space Station on molding compounds for semiconductors designed to reduce the incidence of soft...
by Kyogo Komiyama | Jun 13, 2025 | R&D
May 14, 2025 Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”), Nippon Steel Corporation (President and COO: Tadashi Imai, hereinafter “Nippon Steel”), Nippon Steel Engineering Co., Ltd. (President: Yukito...
by Kyogo Komiyama | May 14, 2025 | Sustainability
May 14, 2025 Resonac Holdings Corporation (President and CEO: Hidehito Takahashi; hereinafter “Resonac”) has been selected for the first time as an “SX Brand 2025” by the Ministry of Economy, Trade and Industry (hereinafter “METI”) and the Tokyo Stock...
