by Kyogo Komiyama | Jun 27, 2025 | Business
June 27 2025 Tokyo, Japan and Austin, TX, Resonac Corporation and PulseForge, Inc. announced a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, 2025. This collaboration aims to drive...
by Kyogo Komiyama | Jun 20, 2025 | R&D
June 19 2025 Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) is set to begin evaluation experiments aboard the International Space Station on molding compounds for semiconductors designed to reduce the incidence of soft...
by Kyogo Komiyama | Jun 13, 2025 | R&D
May 14, 2025 Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”), Nippon Steel Corporation (President and COO: Tadashi Imai, hereinafter “Nippon Steel”), Nippon Steel Engineering Co., Ltd. (President: Yukito...
by Kyogo Komiyama | May 14, 2025 | Sustainability
May 14, 2025 Resonac Holdings Corporation (President and CEO: Hidehito Takahashi; hereinafter “Resonac”) has been selected for the first time as an “SX Brand 2025” by the Ministry of Economy, Trade and Industry (hereinafter “METI”) and the Tokyo Stock...
by Kyogo Komiyama | Apr 22, 2025 | R&D
April 22, 2025 Tokyo － April 22, 2025 － Resonac Corporation (Minato-ku, Tokyo, President and CEO: Hidehito Takahashi) and Yokohama National University (Hodogaya-ku, Yokohama City, President: Izuru Umehara) entered into a comprehensive partnership agreement on April...
