by Kyogo Komiyama | Nov 8, 2024 | Business
November 06, 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter referred to as “Resonac”) is pleased to announce that validity of the Japanese patent for its liquid sealing material for semiconductors (Patent No. 7343977) was upheld by...
by Kyogo Komiyama | Oct 4, 2024 | Sustainability
October 04, 2024 Resonac Holdings Corporation (President: Hidehito Takahashi, hereinafter referred to as “REH”) is pleased to announce that “Sakuragawa Kyoso-no-Sato” (“Sakuragawa Co-creation Village”: Sakuragawa City, Ibaraki Prefecture), the...
by Kyogo Komiyama | Sep 24, 2024 | Business
September 24, 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter referred to as “Resonac”) has signed an agreement with Soitec (CEO: Pierre Barnabé, hereinafter referred to as “Soitec”), a French manufacturer of advanced...
by Kyogo Komiyama | Sep 19, 2024 | Business
September 19, 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process)...
by Kyogo Komiyama | Aug 7, 2024 | Sustainability
07 August 2024 Resonac Holdings Corporation (President: Hidehito Takahashi, hereinafter referred to as “Resonac”) has expressed its support for the disclosure recommendations published in September 2023 by the Taskforce on Nature-related Financial...
