Recent Posts
- Resonac and Tohoku University Launch Joint Research on Technology to Produce SiC Power Semiconductor Materials from Waste Silicon and CO2
- Resonac and PulseForge Unite to Advance Photonic Debonding for Next-Gen Semiconductor Packaging
- Resonac Conducts Evaluation of Semiconductor Materials for Space Applications Aboard International Space Station
- Joint Research and Development on Glycine Production Utilizing Emitted CO2 by Resonac, Nippon Steel, Nippon Steel Engineering, and the University of Toyama Selected by NEDO
- Resonac Holdings Selected as “SX Brand 2025”
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