by Kyogo Komiyama | Jun 27, 2025 | Business
June 27 2025 Tokyo, Japan and Austin, TX, Resonac Corporation and PulseForge, Inc. announced a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, 2025. This collaboration aims to drive...
by Kyogo Komiyama | Jun 20, 2025 | R&D
June 19 2025 Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) is set to begin evaluation experiments aboard the International Space Station on molding compounds for semiconductors designed to reduce the incidence of soft...
by Kyogo Komiyama | Jun 13, 2025 | R&D
May 14, 2025 Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”), Nippon Steel Corporation (President and COO: Tadashi Imai, hereinafter “Nippon Steel”), Nippon Steel Engineering Co., Ltd. (President: Yukito...
