Recent Posts
- Resonac’s Patent for Liquid Sealing Material for Semiconductors Upheld
- Ecosystem Conservation Activity Hub in Ibaraki Prefecture Recognized as a “Nature Coexistence Site” by the Ministry of the Environment
- Resonac and Soitec Sign Agreement to Jointly Develop Bonded Substrates for SiC Power Semiconductors
- Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages
- Resonac Commits to Biodiversity Conservation by Registering as a TNFD Adopter
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