Recent Posts
- Resonac Develops New Photosensitive Film for Advanced Semiconductor Packages
- Resonac Develops AI-Powered Material Exploration Tool
- Resonac’s Patent for Liquid Sealing Material for Semiconductors Upheld
- Ecosystem Conservation Activity Hub in Ibaraki Prefecture Recognized as a “Nature Coexistence Site” by the Ministry of the Environment
- Resonac and Soitec Sign Agreement to Jointly Develop Bonded Substrates for SiC Power Semiconductors
Recent Comments
No comments to show.