by Kyogo Komiyama | Mar 29, 2024 | Business
29 March 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) has decided to increase its capacity to produce materials for high-performance semiconductor chips, which are to be used mainly as CPUs for artificial intelligence (AI), to 3.5 to...
by Kyogo Komiyama | Mar 28, 2024 | Business
28 March 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) has started to consider recycling plastic waste emitted from semiconductor manufacturing process and reusing it as material for semiconductor manufacturing by applying the...
by Kyogo Komiyama | Mar 21, 2024 | R&D
21 March 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) proposed Japan Aerospace Exploration Agency (hereinafter “JAXA”) to conduct research into heat storage and utilization system for use on the lunar surface, which is expected to...
by Kyogo Komiyama | Mar 7, 2024 | R&D
07 March 2024 Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) conducted a tour of its Packaging Solution Center (Kawasaki City, Kanagawa Prefecture, hereinafter referred to as “PSC”), an R&D facility of backend...
