Ultra-low Defect Nano Ceria Slurry

About the product

HS-1 series selectively removes SiO2 over other stopper films, making the slurry useful for STI process. Our unique nano ceria abrasive has small particle size with highly reactive surface, enabling ultra-low defect while maintaining high removal rate. Nano ceria abrasive is prepared via liquid-phase synthesis, in contrast to our other ceria slurries.

Merits

• Very small abrasive minimizing scratches and defects.
• Optimized abrasive size and surface property makes our slurry suitable for the use in STI process
• Combination with our additive allows fine-tuning of polishing selectivity and planarization property.