Map Molding Support Tape RT Series
About the product
RT series is a supporting tape used in the map molding process of QFN and SON. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding. The applications has been expanded to new packages besides QFN and SON.
Features
- Thermoplastic resin with high thermal stability for adhesive layer.
- Good wire bondability.
- No flash burr after molding.
- No Adhesive on a lead frame after detaping.
- Low adhesiveness of the tape at room temperature achieves no dust attachment.
Characteristics (Typical Values)
| Item | Unit | RT-321 | RT-321-CD1 |
|---|---|---|---|
| Features | – | Standard | Higher adhesion for Ni/Pd/Au |
| Bonding temp. | ºC | 200~250 | 190~250 |
| Detaping temp.* | ºC | 25~200 | 25~200 |
| Tensile elongation | % | 50 | 50 |
| Tg | ºC | 220 | 190 |
| Flash burr after molding | – | None | None |
| Residue after detaping | – | None | None |
| Adhesive strength to Ni/Pd/Au | N/m | 50 | 100 |
※ Heating is required for some lead frames and epoxy molding compounds.
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