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PFC (Greenhouse Gas) Abatement Systems

About the product

Resonac’s exhaust gas treatment equipment can discharge greenhouse gas perfluorocarbons (PFCs) generated in semiconductor wafer manufacturing processes as clean gases.​

Resonac offers a dry system that adopts a chemical reaction method with no water treatment required as well as a catalytic system for efficiently decomposing PFCs with high-level safety.​

 

 

Merits

  • PFC decomposition rate of 99% or higher.​
  • Low acid drainage and low environmental impact (no acid drainage for the Clean-S PF Series and up to about 5L/min for the HICDS Series).​
  • Low energy consumption due to low-temperature treatment at reaction temperatures of 600-750℃.
  • Electric heating system with a lower environmental impact than fuel gas systems.​
  • Extensive product lineup available in small to large sizes for rsearch and mass production processes.​

Product lineup

System Series Features
Dry PFC abatement system​​ Clean-S PF Series​ Uses no chemical solutions, coolants, or nitrogen, with no need for wastewater treatment and leakage control.​

Since the PFCs decomposition temperature is relatively low such as 600℃, it helps to save energy.
Catalytic PFC abatement system​​​ HICDS Series​ Enable removal of PFCs from off gas after semiconductor dry etching processes, with a high decomposition rate by catalytic decomposition system at 750℃.

We can provide the PFC removal equipment.

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