Metal Surface Treatment for Semiconductor Manufacturing Equipment
About the product
Resonac’s treatment uses the electroless plating method to deposit multilayer nickel (Ni) alloy film coatings on the metal surface of semiconductor manufacturing equipment.
This surface treatment generates various properties that include corrosion resistance to corrosive gas atmospheres, wear resistance to sliding mechanical components, high mold releasability for rubber and other molds, and reduced mold contamination.
*Image: inner cylinder after surface treatment
Merits
- Plating multilayer film formation provides corrosion resistance superior to ordinary electroless Ni plates and protects the components from corrosion.
- Features high abrasion and mold release properties.
Types of treatment
| Type | Features | Specific applications |
|---|---|---|
| Clean-S Treatment Type A | High hardness, wear resistance | Dry pumps, injection molder screw parts, sliding parts, molds |
| Clean-S Treatment Type H | Corrosion resistance to corrosive gases | Molecular pumps, gas exhaust pipes, corrosion-resistant valves |
| Clean-S Treatment Type AF | High corrosion resistance | Chamber accessories, gas exhaust pipes, valves, parts for seawater and salt damage |
| Clean-S Treatment Type KF | High corrosion resistance, abrasion resistance, low-temperature fluorination (F) treatment | Chamber accessories, molds |
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