MCL-LW-990(Type RFD)
High Tg, Low Transmission Loss Laminate Material
Product form
| CCL | MCL-LW-990(Type RFD) |
| Prepreg | GWA-990(Type D) |
Applications
- High frequency radar/antenna for automotive
- High frequency devices
Features
- Achieved low dielectric constant (Dk) (3.3 at 10 GHz) and low dissipation factor (Df) (0.0020 at 10 GHz) using original resin system and low Dk glass cloth.
- Improved transmission loss by approximately 30% at 77 GHz compared to our MCL-LW-910G, combined with smooth copper foil.
- Has excellent heat resistance and connection reliability.
Characteristics
Dielectric Characterization Results (Aging test)
- Method ： Cavity Resonator
- Aging condition (Temperature & Humidity) ： 85℃/85%RH
- Measurement frequency ： 10 GHz
Transmission Loss
- Measurement Conditions
-
-
- Evaluation PWB ： Micro Strip Line
- Temperature & Humidity ： 25℃/60%RH
- Characteristic impedance ： Approx. 50Ω
- Proofreading method : TRL(Thru-Reflect-Line)
- Trace width (w)：0.3 mm
- Dielectric thickness (b)：0.127 mm
- Trace thickness (t1)：30 μm
- GND thickness (t2)：30 μm
- Copper foil
- MCL-LW-990(Type RFD) ： HVLP
- MCL-LW-910G ： HVLP
- PTFE ： Standard
Copper Clad Laminate
(t0.8mm)
| Item | Condition※3 | Unit | Actual Value | Reference (IPC-TM-650) |
|||
|---|---|---|---|---|---|---|---|
| MCL-LW-990(Type RFD) | |||||||
| Tg | TMA method | A | ℃ | 180–230 | 2.4.24 | ||
| DMA method | A | 220–260 | ‐ | ||||
| CTE ※1 | X (30–120℃) | A | ppm/℃ | 7–10 | ‐ | ||
| Y (30–120℃) | 7-10 | ||||||
| Z | (＜Tg) | A | 35–55 | 2.4.24 | |||
| (＞Tg) | A | 240–290 | |||||
| Solder Heat Resistance (260 ℃) | A | sec. | ≧300 | ‐ | |||
| T-260 (Without Copper) | A | min. | ≧60 | 2.4.24.1 | |||
| T-288 (Without Copper) | ≧60 | ||||||
| Decomposition Temperature (TGA method 5 % Weight Loss) | A | ℃ | 375–405 | 2.3.40 | |||
| Copper Peel Strength | 18 µm HVLP | A | kN/m | 0.4–0.6 | 2.4.8 | ||
| Flexural Modulus (Lengthwise) | A | GPa | 14–19 | 2.4.4 | |||
| Dielectric Constant | 10 GHz ※2 | A | － | 3.1–3.3 | IEC-62810 | ||
| Dissipation Factor | 10 GHz ※2 | A | － | 0.0018–0.0028 | |||
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014–1×1016 | 2.5.7 | |||
| Surface Resistance | C-96/40/90 | Ω | 1×1013–1×1015 | ||||
| Insulation Resistance | A | Ω | 1×1013–1×1015 | ‐ | |||
| D-2/100 | 1×1012–1×1014 | ‐ | |||||
※1 Heating Rate: 10℃/min.(Comp.)
※2 Measured by Cavity Resonator.
※3 Refer to“Condition Note”
※ Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
| Part Number | Type | Copper Foil Thickness | Thickness Code | Laminate Thickness | ||
|---|---|---|---|---|---|---|
| MCL-LW-990 |
(RFD) |
12 µm 18 µm |
M0.06 | 0.06 mm | ||
| M0.08 | 0.08 mm | |||||
| 0.1 | 0.10 mm | |||||
| 0.13 | 0.13 mm | |||||
| 0.26 | 0.25 mm | |||||
| 0.51 | 0.51 mm | |||||
※ Note1) Laminate thickness means dielectric layer thickness.
Prepreg
| Part Number | Type | Glass Cloth | Properties | ||
|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 |
|||
| GWA-990 | 0.05 | (D1035N74) | 1035 | 74±2 | 0.064 mm |
| 0.06 | (D1078N66) | 1078 | 67±2 | 0.078 mm | |
| 0.06 | (D1078N73) | 1078 | 73±2 | 0.101 mm | |
| 0.06 | (D1078N75) | 1078 | 75±2 | 0.112 mm | |
| 0.08 | (D3313N59) | 3313 | 59±2 | 0.101 mm | |
| Reference (IPC-TM-650) | 2.3.16 | ‐ | |||
※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. Values change depending on the press condition or inner layer pattern.
Inquirer about product
Please subscribe our technology eNewsletter!
Inquiry about product
Please inquire about product, technology or samples from here.