MCL-I-671
Polyimide Multilayer Material
Product form
| CCL | MCL-I-671 |
| Prepreg | GIA-671N |
Applications
- Main frame computers and super computers.
- Semiconductor testing equipment, and burn-in boards.
- Flex-rigid PWBs. (No-flow prepreg)
Features
- High Tg (>200℃: DMA) material for high throughhole reliability.
- FR-4 lamination condition can be applied. (175℃, 90 min.)
- MDA, a general polyimide resin curing agent, is not used. (Non-MDA Resin System)
- Resin flow control technology enables from high to low flow.
Characteristics
- Correlation between Dielectric Constant and Frequency
(t0.8mm)
※ Measured by Triplate-line Resonator.
- Correlation between Dissipation Factor and Frequency
(t0.8mm)
- Barcol Hardness
(t0.8mm)
- Water Absorption
PCT Condition: 121℃ 0.22MPa (t0.8mm)
- Thermal Shock Test MIL-STD-202
Method 107E
- Flexural Strength
Copper Clad Laminate
(t0.8mm)
| Item | Condition ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| MCL-I-671 | ||||||
| Tg | TMA method | A | ℃ | 200–213 | 2.4.24 | |
| DMA method | A | 230–245 | – | |||
| CTE ※1 | X (30–120℃) | A | ppm/℃ | 12–15 | – | |
| Y (30–120℃) | 12–16 | |||||
| Z | ＜Tg | A | 50–80 | 2.4.24 | ||
| ＞Tg | A | 200–300 | ||||
| Solder Heat Resistance (260℃) | A | sec. | ＞300 | – | ||
| T-260 (Without Copper) | A | min. | ＞60 | 2.4.24.1 | ||
| T-288 (Without Copper) | A | ＞15 | ||||
| Decomposition Temperature (TGA method 5% Weight Loss) | A | ℃ | 330–350 | 2.3.40 | ||
| Copper Peel Strength | 20℃ | A | kN/m | 1.3–1.5 | 2.4.8 | |
| (18 µm) | 180℃ | A | 1.0–1.2 | |||
| Flexural Modulus (Lengthwise) | A | GPa | 24–26 | 2.4.4 | ||
| Dielectric Constant | 1MHz | A | – | 4.2–4.4 | 2.5.5.9 | |
| 1GHz ※2 | A | – | 4.1–4.3 | JPCA TM-001 | ||
| Dissipation Factor | 1MHz | A | – | 0.0110–0.0130 | 2.5.5.9 | |
| 1GHz ※2 | A | – | 0.0130–0.0150 | JPCA TM-001 | ||
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014–1×1016 | 2.5.17 | ||
| Surface Resistance | C-96/40/90 | Ω | 1×1013–1×1015 | |||
| Insulation Resistance | A | Ω | 1×1014–1×1016 | – | ||
| D-2/100 | 1×1012–1×1014 | – | ||||
※1 Heating Rate: 10℃/min.
※2 Measured by Triplate-line Resonator.
※3 Refer to“Condition Note”
※ Above data are experimental results and not guaranteed.
Standard Specifications
Prepreg
| Part Number | Type | Copper Foil Thickness | Code Name | Laminate Thickness |
|---|---|---|---|---|
| MCL-I-671 | – | 0.06 | 0.06mm | |
| 12 µm | 0.1 | 0.10mm | ||
| 18 µm | 0.2 | 0.20mm | ||
| 35 µm | 0.3 | 0.30mm | ||
| 70 µm | 0.41 | 0.41mm | ||
| 0.79 | 0.79mm |
※ The thickness means that of dielectric layer.
Prepreg
| Part Number | Type | Glass Cloth | Properties | Part Number | ||
|---|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 (mm) |
||||
| GIA-671N | (T) | 0.03 | 106 | 72±3 | 0.059 | MLB |
| 0.05 | 1080 | 65±3 | 0.087 | |||
| 0.1 | 2116 | 54±3 | 0.134 | |||
| (N) | 0.03 | 106 | 68±3 | 0.047 | Flex-rigid PWBs | |
| 0.05 | 1080 | 59±3 | 0.072 | |||
| (F) | 0.05 | 1080 | 74±3 | 0.111 | Metal core PWBs | |
| Reference (IPC-TM-650) | 2.3.16 | – | – | |||
※1 Dielectric thickness after lamination is defined as the theoretical calculation thickness of one sheet of prepreg when the resin flow is 0%. Value changes depending on the press condition or inner layer pattern.
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