High Removal Rate Ceria Slurry

About the product

HS-0 series efficiently removes high step-height oxide pattern, typically used for memory

manufacturing process. These slurries combine our tailor-made abrasive with removal rate accelerator, enabling high removal rate.

Merits

• Polishes SiO₂ films at high removal rate
• Optimized abrasive size and surface property makes our slurry suitable for clearing high step-height pattern.
• High removal rate ensured even at dilute abrasive concentration (<1% CeO₂)