GH-100 (Type D), GH-200 (Type D)
Thin Prepreg with Superior Surface Smoothness
Product form
| Prepreg |
GH-100 (Type D) GH-200 (Type D) |
Applications
- Semiconductor packages. (FC-CSP, PoP, SiP)
- Thinner Module PWB
Features
- GH-100 (TYPE-D) and GH-200 (TYPE-D) have hybrid properties of package and high speed materials.
- Good for impedance control as thickness variation is small after press.
- Halogen free material with low CTE values in X, Y directions (α1, α2).
- Good dielectric properties by applying low dielectric glass cloths.
Characteristics
Surface Smoothness of Prepreg (Microscope)
TYPE-F
Conventional
Panel Warpage of Prepreg after press (w/o copper, by shadow moire)
TYPE-F
Conventional
Prepreg thickness after Press
Laminate condition
- GEA-705G1010F78
- Copper foil: 3 µm
- Laminate condition
- Temp.: 230℃100min
- Heating rate: 3.0℃/min
- Pressure: 3MPa
Undulation of prepreg after press (GEA-705G1010F78)
TYPE-F
Conventional
Copper Clad Laminate
(t0.2, t0.4mm)
| Item | Condition ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
|||
|---|---|---|---|---|---|---|---|
| GH-100 (Type D) |
GH-200 (Type D) |
||||||
| Tg | TMA method | A | ℃ | 240–260 | 240–260 | 2.4.24 | |
| DMA method | A | 240–260 | 240–260 | – | |||
| CTE ※1 (Pull) | X (30–120℃) | A | ppm/℃ | 6–8 | 8–10 | 2.4.24.5 | |
| Y (30–120℃) | 6–8 | 8–10 | |||||
| Solder Heat Resistance (260℃) | A | sec. | ＞300 | – | |||
| T-260 (Without Copper) | A | min. | ＞60 | 2.4.24.1 | |||
| T-288 (Without Copper) | A | ＞60 | |||||
| Dielectric Constant ※2 | 10GHz | A | – | 3.5–3.7 | 3.2–3.4 | IEC-62610 | |
| Dissipation Factor ※2 | 10GHz | A | – | 0.0085–0.0035 | 0.0080–0.0030 | ||
※1 Heating Rate: 10℃/min.
※2 Measured by cavity resonator method.
※3 Refer to“Condition Note”
※ Above data are experimental results and not guaranteed.
Standard Specifications
Prepreg
| Part Number | Type | Glass Cloth | Properties | |||
|---|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 (mm) |
||||
| GH-100 | (D) | 0.025 | 1017F71K | 1017 | 71±2 | 0.027 |
| 1017F73K | 73±2 | 0.029 | ||||
| 1017F75K | 75±2 | 0.031 | ||||
| 1017F77K | 77±2 | 0.034 | ||||
| 1017F79K | 79±2 | 0.038 | ||||
| GH-200 | (D) | 0.025 | 1017F68K | 1017 | 68±2 | 0.020 |
| 1017F70K | 70±2 | 0.022 | ||||
| 1017F72K | 72±2 | 0.024 | ||||
| 1017F74K | 74±2 | 0.026 | ||||
| 1017F76K | 76±2 | 0.028 | ||||
| 1017F78K | 78±2 | 0.031 | ||||
| 1017F80K | 80±2 | 0.034 | ||||
| 1017F82K | 82±2 | 0.038 | ||||
| 1017F84K | 84±2 | 0.043 | ||||
| Reference (IPC-TM-650) | 2.3.16 | – | ||||
※1 The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. This value changes depending on the press condition or inner layer pattern.
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