Anisotropic Conductive Films for for IC chip
About the product
This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and IC chip.
Applications
Interconnection between LCD and driver IC
Features
- Microscopic bump applicable
- High adhesion and high reliability
- Low contact resistance
- Short bonding time
- For low stress
Characteristics
| Item | Unit | AC-8000 series | |
|---|---|---|---|
| Application | – | for IC chip | |
| Fine pitch capability | Min. contact area | μm2 | 600 |
| Min. space | μm | 10 | |
| Bonding condition |
Temp. | ºC | 140~ |
| Time | sec | 5~ | |
| Pressure | MPa | 40~* | |
※Based on electrode area
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