Cu and Barrier Metal Polishing Colloidal Silica Slurry

About the product

HS-T series is suitable for polishing films containing Cu, barrier metal, and SiO2 films, typically used for interconnect fabrication process.

Depending on the customer’s polishing films and desired topography, Resonac offers various slurry lineups.

Merits

• Ultrapure colloidal silica used. Metal ion contamination minimized.
• Optimized formulation suitable for interconnect fabrication process.
• Shipped at highly concentrated state, saving shipment and/or storage energy consumption.
• High removal rate even at dilute condition: fewer scratch and lower cost of ownership.