Photosensitive Insulation Coating materisl for RDL (AH series)
About the product
AH series is photosensitive and low temperature curable insulation coating. It can be patterned via photolithography and provides excellent film properties even by low temperature cure.
Features
- Positive-tone photosensitive and developable by 2.38 % TMAH solution as an aqueous developer.
- Low temperature curable (200 ℃-).
- Excellent curing film properties enable low warpage and improve assembly reliability.
- Suitable for insulation layers in semiconductor PKG.
- NMP free
Characteristics
(In house evaluation data)
| Items | Units | AH Series |
|---|---|---|
| Applicable film thickness | µm | 2～20 |
| Exposure dose* | mJ/cm2 | 400 |
| Cure temperature | ºC | 230 |
| Glass transition temperature | ºC | 253 |
| Young’s modulus | GPa | 2.4 |
| Elongation | % | 60 |
| Coefficient of thermal expansion | ppm/ºC | 49 |
| Residual stress | MPa | 18 |
*10 µm film thickness after cure
Cross Section of AH Series after Cure
2 µm via @10 µmt
30 µm lens @15 µmt
Application Example of AH Series for Redistribution Insulation Layers on WL-CSP
Application Example of AH Series
for Redistribution Insulation Layers on WL-CSP
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