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2023.10.02

Resonac hold a webinar “Material Solutions for Next Generation Power Module”

2023.09.22

Resonac Forms Strategic Partnership with Matmerize in Materials Informatics

2023.09.04

Meet us at ICSCRM 2023 in Sorrento from September 17-22 2023!

2023.08.03

Resonac’s Oita Complex Acquires ISCC PLUS certification

2023.07.12

Resonac Automates Material Inspection by Utilizing Deep Learning-Based Image Analysis

2023.06.27

“JOINT2” Consortium Enhances Its Proposal Capability for the Development of Next-Generation Semiconductor Packaging Technologies

2023.06.12

Resonac Decides to Acquire 100% Shares in AMI Automation

2023.05.19

Becoming the First in Japan to Acquire International Certification for a Supply Chain That Adopts Materials Derived from Used Plastic

2023.04.04

Resonac to exhibit at PCIM Europe, the leading international exhibition and conference for Power electronics in Nürnberg Germany, May 9th-11th

2023.04.04

Resonac Group to Integrate and Relocate Head Offices

2023.04.04

Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60%

2023.03.31

DENSO Adopts Resonac’s SiC Epi-wafer for Power Semiconductor for Use in Inverter

2023.03.23

Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules

2023.03.13

Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base

2023.03.09

RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development

2023.03.01

Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers

2023.01.12

Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors

2023.01.04

Resonac Aims to be a Leading Functional Chemical Manufacturer by Raising Reformers

2022.10.25

Company name change

2022.09.12

Meet us at FEICA Adhesive and Sealants Conference and Expo 2022!