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News Releases

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2024.03.21

R&D

JAXA Adopts Resonac’s Proposal to Study Heat Storage and Utilization System for Use on the Lunar Surface

2024.03.07

R&D

Participants in the ISES Japan Summit Visit Resonac’s Semiconductor Backend Process R&D Base

2024.01.18

R&D

Resonac Develops an Original Generative AI, “Chat Resonac,” That Utilizes Accumulated In-house Materials Including Handwritten Documents

2023.12.21

R&D

Resonac Dramatically Reduces Materials Development Time Using AI Based on Deep Learning Technology

2023.12.13

Business

Resonac Contracts with Nippon Yusen and JERA to Make Joint Effort to Realize Supply of Ammonia Fuel to a Tugboat

2023.11.30

Sustainability

Resonac Creates Chief Sustainability Officer (CSuO) as a New Position

2023.11.22

R&D

Resonac Participates in a US-based Leading-edge Semiconductor Consortium as The First Japanese Strategic Material Manufacturing Partner

2023.11.22

R&D

Resonac Plans to Establish Semiconductor Back End Process R&D Center in Silicon Valley

2023.10.02

Business

Resonac hold a webinar “Material Solutions for Next Generation Power Module”

2023.09.22

R&D

Resonac Forms Strategic Partnership with Matmerize in Materials Informatics

2023.09.04

Business

Meet us at ICSCRM 2023 in Sorrento from September 17-22 2023!

2023.08.03

Business

Resonac’s Oita Complex Acquires ISCC PLUS certification

2023.07.12

Business

Resonac Automates Material Inspection by Utilizing Deep Learning-Based Image Analysis

2023.06.27

Business

“JOINT2” Consortium Enhances Its Proposal Capability for the Development of Next-Generation Semiconductor Packaging Technologies

2023.06.12

Business

Resonac Decides to Acquire 100% Shares in AMI Automation

2023.05.19

Business

Becoming the First in Japan to Acquire International Certification for a Supply Chain That Adopts Materials Derived from Used Plastic

2023.04.04

Business

Resonac to exhibit at PCIM Europe, the leading international exhibition and conference for Power electronics in Nürnberg Germany, May 9th-11th

2023.04.04

Others

Resonac Group to Integrate and Relocate Head Offices

2023.04.04

Business

Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60%

2023.03.31

Business

DENSO Adopts Resonac’s SiC Epi-wafer for Power Semiconductor for Use in Inverter