Home > News Release

News Releases

Show Filter

Reset

2024.11.08

Resonac’s Patent for Liquid Sealing Material for Semiconductors Upheld

2024.09.24

Resonac and Soitec Sign Agreement to Jointly Develop Bonded Substrates for SiC Power Semiconductors

2024.09.19

Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages

2024.07.08

Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley

2024.06.05

Resonac join PCIM 2024

2024.05.28

Resonac Corporation, Neste and Marubeni Corporation to cooperate on renewable chemicals in Japan

2024.03.29

Resonac Increases Capacity to Produce Materials for AI Chips

2024.03.28

Resonac Starts to Consider Recycling Plastic Waste Emitted from Semiconductor Manufacturing Process and Reusing It as Gases for Semiconductor Manufacturing

2023.12.13

Resonac Contracts with Nippon Yusen and JERA to Make Joint Effort to Realize Supply of Ammonia Fuel to a Tugboat

2023.10.02

Resonac hold a webinar “Material Solutions for Next Generation Power Module”

2023.09.04

Meet us at ICSCRM 2023 in Sorrento from September 17-22 2023!

2023.08.03

Resonac’s Oita Complex Acquires ISCC PLUS certification

2023.07.12

Resonac Automates Material Inspection by Utilizing Deep Learning-Based Image Analysis

2023.06.27

“JOINT2” Consortium Enhances Its Proposal Capability for the Development of Next-Generation Semiconductor Packaging Technologies

2023.06.12

Resonac Decides to Acquire 100% Shares in AMI Automation

2023.05.19

Becoming the First in Japan to Acquire International Certification for a Supply Chain That Adopts Materials Derived from Used Plastic

2023.04.04

Resonac to exhibit at PCIM Europe, the leading international exhibition and conference for Power electronics in Nürnberg Germany, May 9th-11th

2023.04.04

Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60%

2023.03.31

DENSO Adopts Resonac’s SiC Epi-wafer for Power Semiconductor for Use in Inverter

2023.03.01

Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers