PFC (Greenhouse Gas) Abatement Systems
About the product
Resonac’s exhaust gas treatment equipment can discharge greenhouse gas perfluorocarbons (PFCs) generated in semiconductor wafer manufacturing processes as clean gases.
Resonac offers a dry system that adopts a chemical reaction method with no water treatment required as well as a catalytic system for efficiently decomposing PFCs with high-level safety.
Merits
- PFC decomposition rate of 99% or higher.
- Low acid drainage and low environmental impact (no acid drainage for the Clean-S PF Series and up to about 5L/min for the HICDS Series).
- Low energy consumption due to low-temperature treatment at reaction temperatures of 600-750℃.
- Electric heating system with a lower environmental impact than fuel gas systems.
- Extensive product lineup available in small to large sizes for rsearch and mass production processes.
Product lineup
| System | Series | Features |
|---|---|---|
| Dry PFC abatement system | Clean-S PF Series | Uses no chemical solutions, coolants, or nitrogen, with no need for wastewater treatment and leakage control. Since the PFCs decomposition temperature is relatively low such as 600℃, it helps to save energy. |
| Catalytic PFC abatement system | HICDS Series | Enable removal of PFCs from off gas after semiconductor dry etching processes, with a high decomposition rate by catalytic decomposition system at 750℃. We can provide the PFC removal equipment. |
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