MCL-HE-679G (Type S)
Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material
Product form
| CCL | MCL-HE-679G (Type S) |
| Prepreg | GHA-679G (Type S) |
Applications
- Network applications.
- High-frequency parts. (filters, VCOs, etc.)
Features
- Enables lower transmission loss than MCL-HE-679G with lower dissipation factor.
- High Tg and superior heat resistance for soldering. (Suitable for lead free process)
- CTE in Z-direction is 30% lower than that of standard FR-4.
- Achieved UL 94V-O flammability standard without using any compound which includes halogen, antimony or red phosphorous.
Characteristics
Correlation between Dielectric Constant and Frequency
Correlation between Dissipation Factor and Frequency
Transmission Loss
Copper Clad Laminate
(t0.8mm)
| Item | Condition ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| MCL-HE-679G (Type S) | ||||||
| Tg | TMA method | A | ℃ | 180–190 | 2.4.24 | |
| DMA method | A | 260–280 | – | |||
| CTE ※1 | X (30–120℃) | A | ppm/℃ | 12–15 | – | |
| Y (30–120℃) | 14–17 | |||||
| Z ※4 | ＜Tg | A | 30–40 | 2.2.24 | ||
| ＞Tg | A | 190–230 | ||||
| Solder Heat Resistance (260℃) | A | sec. | ＞300 | – | ||
| T-260 (Without Copper) | A | min. | ＞60 | 2.4.24.1 | ||
| T-288 (Without Copper) | A | ＞60 | ||||
| Decomposition Temperature (TGA method 5% Weight Loss) | A | ℃ | 370–390 | 2.3.40 | ||
| Copper Peel Strength (RT) | 18 µm | A | kN/m | 0.5–0.7 | 2.4.8 | |
| 35 µm | A | 0.6–0.8 | ||||
| Flexural Modulus (Lengthwise) | A | GPa | 23–26 | 2.4.4 | ||
| Dielectric Constant | 1GHz ※2 | A | – | 3.70–3.90 | JPCA TM-001 | |
| 10GHz ※2 | A | – | 3.6–3.8 | |||
| Dissipation Factor | 1GHz ※2 | A | – | 0.0060–0.0080 | ||
| 10GHz ※2 | A | – | 0.007–0.009 | |||
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014–1×1016 | 2.5.17 | ||
| Surface Resistance | C-96/40/90 | Ω | 1×1013–1×1015 | |||
| Insulation Resistance | A | Ω | 1×1014–1×1016 | – | ||
| D-2/100 | 1×1012–1×1014 | – | ||||
※1 Heating Rate: 10℃/min.
※2 Measured by Triplate-line Resonator.
※3 Measured by Material Analyzer.
※4 Refer to“Condition Note”
※ Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
| Part Number | Type | Copper Foil Thickness | Code Name | Laminate Thickness |
|---|---|---|---|---|
| MCL-HE-679G | (S) | 12 µm 18 µm 35 µm 70 µm |
0.06 | 0.06mm |
| 0.08 | 0.08mm | |||
| 0.1 | 0.10mm | |||
| 0.15 | 0.15mm | |||
| 0.2 | 0.20mm | |||
| 0.4 | 0.40mm | |||
| 0.6 | 0.60mm | |||
| 0.8 | 0.80mm |
※ Laminate thickness means dielectric thickness.
Prepreg
| Part Number | Type | Glass Cloth | Properties | ||
|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 (mm) |
|||
| GHA-679G | 0.04 | (S1037N72) | 1037 | 72±2 | 0.053 |
| 0.06 | (S1080N64) | 1080 | 64±2 | 0.080 | |
| 0.06 | (S1080N69) | 1080 | 69±2 | 0.095 | |
| 0.06 | (S1078N64) | 1078 | 64±2 | 0.078 | |
| 0.08 | (S3313N56) | 3313 | 56±2 | 0.105 | |
| 0.08 | (S3313N62) | 3313 | 62±2 | 0.126 | |
| 0.1 | (S2116N54) | 2116 | 54±2 | 0.128 | |
| 0.1 | (S2116N60) | 2116 | 60±2 | 0.152 | |
| Reference (IPC-TM-650) | 2.3.16 | – | |||
※ Dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. Value changes depending on the press condition or inner layer pattern.
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