MCL-E-795G
Halogen Free, High Tg, High Elastic Modulus and Low CTE material
Product form
| CCL | MCL-E-795G |
| Prepreg | GEA-795G |
Applications
- Semiconductor pakages. (FC-BGA)
- Center core for Buildup construction.
Features
- MCL-E-795G has low CTE value in X, Y directions and can reduce warpage of package significantly.
- MCL-E-795G type LH has low CTE value.
- Well-suited for Center Core of Buildup construction.
Characteristics
Warpage Performance [3-2-3 construction]
TEG Chip
- Die size: 20mm×20mm
- Die height: 775 µm
TEG Substrate
- Package size: 40mm×40mm
- Core thickness: 0.4mm / 0.8mm
- BU thickness: 20 µm
- SR thickness: 19 µm
Copper Clad Laminate
(t0.4mm)
| Item | Condition ※4 | Unit | Actual Value | Reference (IPC-TM-650) |
|||||
|---|---|---|---|---|---|---|---|---|---|
| MCL-E- 795G |
MCL-E- 795G (Type X) |
MCL-E- 795G (Type L) |
MCL-E- 795G (Type LH) |
||||||
| Tg | TMA method | A | ℃ | 260–290 | 2.4.24 | ||||
| DMA method | A | 315–345 | – | ||||||
| CTE ※1 | X (30–120℃) | A | ppm/℃ | 3.0–5.0 | 2.0–4.0 | 1.0–3.5 | 0.5–3.0 | – | |
| Y (30–120℃) | A | 3.0–5.0 | 2.0–4.0 | 1.0–3.5 | 0.5–3.0 | ||||
| Z ※2 | (＜Tg) | A | 10–15 | 2.4.24 | |||||
| (＞Tg) | A | 70–100 | |||||||
| Solder Heat Resistance (260℃) | A | sec. | ＞300 | – | |||||
| T-260 (Without Copper) | A | min. | ＞60 | 2.4.24.1 | |||||
| T-288 (Without Copper) | A | ＞60 | |||||||
| Decomposition Temperature (TGA, 5% weight loss) | A | ℃ | 470–490 | 2.3.40 | |||||
| Heat Resistance for HDI Process (Semi-Additive) | 260℃ Reflow | cycles | ＞20 | – | |||||
| Copper Peel Strength | 12 µm | A | kN/m | 0.7–0.9 | 2.4.8 | ||||
| 18 µm | A | 0.8–1.0 | |||||||
| Flexural Modulus (X) ※2 | A | GPa | 35–37 | 37–39 | 39–41 | 40–42 | – | ||
| Dielectric Constant | 1GHz ※3 | A | – | 4.3–4.5 | 4.2–4.4 | 4.1–4.3 | 4.1–4.3 | – | |
| Dissipation Factor | 1GHz ※3 | A | – | 0.005–0.007 | 0.005–0.007 | 0.005–0.007 | 0.005–0.007 | – | |
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014–1×1016 | 2.5.17 | |||||
| Surface Resistance | C-96/40/90 | Ω | 1×1013–1×1015 | ||||||
| Insulation Resistance | A | Ω | 1×1014–1×1016 | – | |||||
| D-2/100 | 1×1012–1×1015 | – | |||||||
※1 Heating Rate: 10℃/min.
※2 For 800um thickness.
※3 Measured by SPDR.
※4 Refer to “Condition Note”
※ Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
| Part Number | Type | Copper Foil Thickness | Thickness Code | Actual thickness and Tolerance |
|---|---|---|---|---|
| MCL-E- 795G |
– | 12 µm 18 µm (STD) 2 µm 3 µm 12 µm (LP) |
M0.06 | 0.06mm |
| 0.1 | 0.11mm | |||
| 0.2 | 0.21mm | |||
| 0.41 | 0.41mm | |||
| 0.61 | 0.61mm | |||
| 0.81 | 0.82mm | |||
| 1.01 | 1.02mm | |||
| 1.21 | 1.23mm | |||
| 1.41 | 1.43mm | |||
| (X) | 12 µm 18 µm (STD) 2 µm 3 µm 12 µm (LP) |
0.41 | 0.41mm | |
| 0.61 | 0.62mm | |||
| 0.81 | 0.82mm | |||
| 1.01 | 1.02mm | |||
| 1.21 | 1.23mm | |||
| 1.41 | 1.43mm | |||
| (L) | 12 µm 18 µm (STD) 2 µm 3 µm 12 µm (LP) |
0.1 | 0.11mm | |
| 0.2 | 0.21mm | |||
| 0.41 | 0.41mm | |||
| 0.61 | 0.62mm | |||
| 0.81 | 0.82mm | |||
| 1.01 | 1.03mm | |||
| 1.21 | 1.24mm | |||
| 1.41 | 1.44mm | |||
| (LH) | 12 µm 18 µm (STD) 2 µm 3 µm 12 µm (LP) |
D0.15 | 0.16mm | |
| 0.2 | 0.21mm | |||
| 0.41 | 0.43mm | |||
| 0.61 | 0.64mm | |||
| 0.81 | 0.85mm | |||
| 1.01 | 1.07mm | |||
| 1.21 | 1.28mm | |||
| 1.41 | 1.49mm |
※1 STD: Standard copper foil, LP: Low Profile copper foil.
※2 The thickness means that of dielectric layer.
Prepreg
| Part Number | Type | Glass Cloth | Properties | |||
|---|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 (mm) |
||||
| GEA-795G | – | 0.03 | (1027N76) | 1027 | 76±2 | 0.044 |
| 0.04 | (1037N76) | 1037 | 76±2 | 0.053 | ||
| 0.06 | (1078N66) | 1078 | 66±2 | 0.072 | ||
| (L) | 0.03 | (1027N76) | 1027 | 76±2 | 0.044 | |
| 0.04 | (1037N76) | 1037 | 76±2 | 0.053 | ||
| 0.06 | (1280N63) | 1280 | 63±2 | 0.072 | ||
※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 0%.
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