MCL-E-679FG
Halogen Free, High Elastic Modulus, Low CTE Multilayer Material
Product form
| CCL | MCL-E-679FG |
| MCL-E-679FGB〈Black Type〉 | |
| Prepreg | GEA-679FG |
Applications
- Semiconductor packages. (FC-BGA, BGA, CSP)
- Build up PWB.
- Personal computer, high density electronic equipment.
Features
- Halogen free material for environmental concerns.
- CTE (Z-direction) is 50% lower than that of our standard FR-4.
- Elastic modulus is 20% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection.
- Superior heat resistance for soldering (suitable for lead free process).
- Suitable for fine patterning with 1/4 surface roughness of our standard FR-4 pattern possible.
Characteristics
Through-hole reliability
- Test condition: －55℃, 30min. ⇔150℃, 30min.
- Pattern: Wall to wall distance 0.3mm, Laminate thickness: t0.8mm
- Pre-condition: 260℃ reflow × 2times⇒Solder dipping (260℃ 10sec.)
Stiffness Properties
Prepreg thickness after pattern filling (Inner layer copper 15 µm)
Copper Clad Laminate
(t0.4, t0.8mm)
| Item | Condition ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
|||||
|---|---|---|---|---|---|---|---|---|---|
| MCL-E- 679FGB (Type R) |
MCL-E- 679FG (Type R) |
MCL-E- 679FGB (Type S) |
MCL-E- 679FG (Type S) |
||||||
| Tg | TMA method | A | ℃ | 165–175 | 175–185 | 2.4.24 | |||
| DMA method | A | 200–220 | 210–230 | – | |||||
| CTE ※1 | X (30–120℃) | A | ppm/℃ | 13–15 | 12–14 | – | |||
| Y (30–120℃) | A | 13–15 | 12–14 | ||||||
| Z | (＜Tg) | A | 23–33 | 20–30 | 2.4.24 | ||||
| (＞Tg) | A | 140–170 | 130–160 | ||||||
| Solder Heat Resistance (260℃) | A | sec. | ＞300 | – | |||||
| T-260 (Without Copper) | A | min. | ＞60 | 2.4.24.1 | |||||
| T-288 (Without Copper) | A | ＞60 | |||||||
| Decomposition Temperature (TGA method 5% Weight Loss) | A | ℃ | 340–360 | 2.3.40 | |||||
| Heat Resistance for HDI Process | 260℃ Reflow | cycles | ＞10 | – | |||||
| Copper Peel Strength | 18 µm | A | kN/m | 0.9–1.1 | 1.1–1.2 | 2.4.8 | |||
| 35 µm | A | 1.1–1.2 | 1.2–1.3 | ||||||
| Surface Roughness (Ra) | A | µm | 2–3 | 2.2.17 | |||||
| Flexural Modulus (Lengthwise) | A | GPa | 23–28 | 24–29 | – | ||||
| Dielectric Constant | 1GHz ※2 | A | – | 4.9–5.1 | – | ||||
| 10GHz ※2 | 4.8–5.0 | – | |||||||
| Dissipation Factor | 1GHz ※2 | A | – | 0.013–0.015 | – | ||||
| 10GHz ※2 | 0.014–0.016 | – | |||||||
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014–1×1016 | 2.5.17 | |||||
| Surface Resistance | C-96/40/90 | Ω | 1×1013–1×1015 | ||||||
| Insulation Resistance | A | Ω | 1×1014–1×1016 | – | |||||
| D-2/100 | 1×1012–1×1014 | – | |||||||
※1 Heating Rate: 10℃/min.
※2 Measured by SPDR method.
※3 Refer to“Condition Note”
※ Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
| Part Number | Type | Copper Foil Thickness | Code Name | Laminate Thickness |
|---|---|---|---|---|
| MCL-E-679FG MCL-E-679FGB |
(S) | 3, 12, 18 µm (STD, LP) |
T0.07 | 0.07mm |
| M0.06 | 0.07mm | |||
| (R) (S) |
3 µm 12 µm 18 µm, 35 µm (STD, LP) |
0.1 | 0.11mm | |
| 0.2 | 0.20mm | |||
| 0.41 | 0.40mm | |||
| 0.81 | 0.80mm |
※1 STD: Standard copper foil, LP: Low profile copper foil,
※2 STD: 12 µm, 18 µm, 35 µm; LP: 3 µm, 12 µm, 18 µm.
※3 “U” for 1-ply“; T” for 2-ply.
※4 The thickness means that of dielectric layer.
Prepreg
| Part Number | Type | Glass Cloth | Properties | |||
|---|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 (mm) |
||||
| GEA-679FG ※2 | (R) | 0.03 | (GBPE) | 1027 | 73±2 | 0.040 |
| 0.04 | (GRZPE) | 1037 | 73±2 | 0.048 | ||
| 0.06 | (GRROE) | 1078 | 68±2 | 0.079 | ||
| 0.1 | (GRSKE) | 2116 | 58±2 | 0.127 | ||
| (S) | 0.03 | (GSBPE) | 1027 | 73±2 | 0.040 | |
| 0.03 | (GSBSE) | 1027 | 78±2 | 0.050 | ||
| 0.04 | (GSZPE) | 1037 | 73±2 | 0.048 | ||
| 0.06 | (GSROE) | 1078 | 68±2 | 0.079 | ||
| 0.1 | (GSSKE) | 2116 | 58±2 | 0.127 | ||
| Reference (IPC-TM-650) | 2.3.16 | – | ||||
※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. This value changes depending on the press condition or inner layer pattern.
※2 Black type is not available for prepreg.
Inquirer about product
Please subscribe our technology eNewsletter!
Inquiry about product
Please inquire about product, technology or samples from here.