Hexagonal Boron Nitride Powder SHOBN™

What is Hexagonal Boron Nitride?

Hexagonal Boron Nitride (h-BN) is a compound where boron and nitrogen form a hexagonal lattice structure, often referred to as “white graphite.” This material possesses high thermal stability, remaining stable at temperatures above approximately 900°C, making it suitable for use in high-temperature environments. Additionally, h-BN is an excellent electrical insulator, used in electronic devices and insulating materials. Its layered structure also provides low friction, making it effective as a lubricant. Chemically, it is highly stable and resistant to acids and bases. 

Resonac’s Hexagonal Boron Nitride (SHOBN™ UHP series)

The SHOBN™ UHP series is a crystal powder of high-purity, white, hexagonal boron nitride characterized by excellent lubricity and release properties. It remains stable up to approximately 3,000°C in an inert atmosphere. The SHOBN™ UHP series exhibits high corrosion resistance and superior electrical properties. In addition to its stability against most organic solvents and corrosive chemicals, and its non-wettability by most molten metals and glasses, it also possesses high electrical insulation and voltage resistance at elevated temperatures, with no changes in permittivity and dielectric loss even at high frequencies. The friction coefficient remains unaffected at significantly high temperatures in a nitrogen atmosphere, allowing usage up to approximately 950°C in the air. Its high thermal conductivity and heat radiation properties render it suitable for various types of heat radiators.

SEM images

Typical properties of common grades

Particle Size Distribution

Application
SHOBN™ UHP series can use for Thermal Conductive Filler

For Flexible sheet

Our SHOBN™ UHP series can be used in a flexible sheet such as rubber, silicon, and the other material based. The fillers of the SHOBN™ UHP series works as a thermal conductive pass to deliver heat from one side to the other side of the sheet with keeping flexibility of the sheet. 

For Gap Filler

SHOBN™ UHP series is commonly used in gap filler applications for thermal management. High electrical insulation and voltage resistance of SHOBN™ UHP series is ideal for transferring heats from components to heat sinks while preventing electrical interference. 

For Thermal Adhesives 

SHOBN™ UHP series is used in the adhesive application to improve thermal conductivity while maintaining electrical insulation. It can be used for semiconductor manufacturing to bond semiconductor components.