Resonac Europe

AH Series

Photosensitive Insulation Coating

About the product

AH series is photosensitive and low temperature curable insulation coating. It can be patterned via photolithography and provides excellent film properties even by low temperature cure.

Features

  • Positive-tone photosensitive and developable by 2.38 % TMAH solution as an aqueous developer.
  • Low temperature curable (200 ℃-).
  • Excellent curing film properties enable low warpage and improve assembly reliability.
  • Suitable for insulation layers in semiconductor PKG.
  • NMP free

Characteristics

(In house evaluation data)

Items Units AH Series
Applicable film thickness µm 2~20
Exposure dose* mJ/cm2 400
Cure temperature ºC 230
Glass transition temperature ºC 253
Young’s modulus GPa 2.4
Elongation % 60
Coefficient of thermal expansion ppm/ºC 49
Residual stress MPa 18

*10 µm film thickness after cure

Cross Section of AH Series after Cure

2 µm via @10 µmt

30 µm lens @15 µmt

Application Example of AH Series for Redistribution Insulation Layers on WL-CSP

Application Example of AH Series
for Redistribution Insulation Layers on WL-CSP

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