by weissblaumedia | Nov 24, 2022
Home Semiconductor Related Materials Page 2 Dicing Die Bonding Film FH Series Die Bonding Film ; About the product ; Features ; Characteristics (Typical Values) About the product FH series is a two-in-one film with the functions for both dicing tape and die bonding...
by weissblaumedia | Nov 24, 2022
Home Project Page 18 for Substrate Die Bonding Paste ＜EPINAL＞ ; About the product ; Features ; Characteristics (Typical Values) About the product “EPINAL” has an excellent adhesion to various materials. The adhesiveness is controllable for different chip...
by weissblaumedia | Nov 24, 2022
Home Project Page 18 for Lead Frame Die Bonding Paste ＜EPINAL＞ ; About the product ; Features ; Characteristics (Typical Values) About the product “EPINAL” has been used as a die bonding adhesive for semiconductor devices. We have a top-level market share...
by weissblaumedia | Nov 24, 2022
Home Project Page 18 CEL-W Series White Epoxy Molding Compounds for LED Reflector ; About the product ; Features ; Characteristics (Typical Values) About the product CEL-W series is thermoset resin for reflector of surface mount LED. LED reflector with good...
by weissblaumedia | Nov 24, 2022
Home Project Page 19 CEL-C Series Liquid Encapsulants ; About the product ; Features ; Characteristics (Typical Values) About the product We develop various types of liquid encapsulants along with cutting-edge packaging trend, COF, FCBGA, wafer level CSP and so on....
