by weissblaumedia | Dec 15, 2022
Home Semiconductor Related Materials High Heat Resistant Coating Materials <HIMAL> ; About the product ; Features ; Applications ; Characteristics (Typical Values) About the product HIMAL HL series is a high heat resistant coating material which forms high...
by weissblaumedia | Nov 25, 2022
Home Project Page 17 Map Molding Support Tape RT Series ; About the product ; Features ; Characteristics (Typical Values) About the product RT series is a supporting tape used in the map molding process of QFN and SON. Attaching on the reverse face of a lead frame, it...
by weissblaumedia | Nov 25, 2022
Home Project Page 17 Release Sheet RM-4000 Series ; About the product ; Features ; Molding experiment example ; Characteristics About the product RM-4100 reduces the flash burr in molding QFN etc. package. Features Flat molding surface can be given, because of...
by weissblaumedia | Nov 24, 2022
Home Project Page 17 N-CS Series Cleaning Sheet for Semiconductor Encapsulation Molding Die ; About the product ; Features ; How to Use ; Line-up ; Cleaning Performance ; N-CS W type -High filling performance for small-sized cavity- About the product N-CS series is...
by weissblaumedia | Nov 24, 2022
Home Project Page 17 Die Bonding Film HS Series ; About the product ; Features ; Characteristics (Typical Values) About the product HS Series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. The uniform die bonding layer can...
